Applied Materials Israel Limited

Yehonatan Ridelman

Boaz Cohen

Boris Sherman

Ran Badanes

Yehonatan Hai Ofir

There is provided a system and method for defect examination on a semiconductor specimen. The method comprises obtaining a runtime image of the semiconductor specimen, generating a reference image based on the runtime image using a machine learning (ML) model, and performing defect examination on the runtime image using the generated reference image. The ML model is previously trained during setup using a training set comprising one or more pairs of training images, each pair including a defective image and a corresponding defect-free image. The training comprises, for each pair, processing the defective image by the ML model to obtain a predicted image, and optimizing the ML model to minimize a difference between the predicted image and the defect-free image.

Growing community of inventors

Gan-Yavne, Israel

Yehonatan Ridelman