Anelva Corporation

Canon Anelva Corporation

Yasuyuki Shirai

Nobuyuki Takahashi

Ryuji Sugimoto

Junji Nakamura

Yohsuke Shibuya

Tomoaki Osada

Hirofumi Asanuma

A vacuum processing apparatus having a vacuum chamber includes a gate valve arranged in the vacuum chamber and including a valve body which moves in a direction relative to an exhaust port of the vacuum chamber to open/close the exhaust port, and a driving unit configured to move the valve body, a connecting portion having one end connected to the exhaust port of the vacuum chamber and formed in a direction inclined from a moving direction of the valve body, and an exhaust pump connected to an opposite end of the connecting portion and capable of evacuating an interior of the connecting portion. The driving unit includes (i) a rod serving as a driving shaft which drives the valve body in a direction to close the exhaust port or a direction to open the exhaust port, and (ii) a cylinder driving the rod, and the rod extends parallel to a moving direction of the valve body and supports the valve body at one end. In addition, the connecting portion is connected to the exhaust port of the vacuum chamber in a direction inclined at a predetermined angle from an axial direction of the rod, and the cylinder is arranged outside the connecting portion and connected to an opposite end of the rod.

Vacuum processing apparatus, method of controlling vacuum processing apparatus, device manufacturing method, and storage medium

There is provided a substrate support device capable of preventing powder dust from being produced. A thermoconductive intermediate member is interposed between a base table and a substrate support table and has a communication aperture path for communicating the aperture path of the base table with the aperture path of the substrate support table. An elastic member such as bellows tube is disposed in the communication aperture path of the thermoconductive intermediate member, for insulating the thermoconductive intermediate member from the inert gas which flows through the communication aperture path.

Substrate support device and plasma processing apparatus

A mechanism for completely separating a substrate, such as a semiconductor substrate, from at base in such a way that the substrate is in a horizontal position and can be easily removed from an electrostatic chuck. The substrate is mounted on a pedestal which is placed on a base such as an electrode. Pins are mounted within the base beneath a central portion of the substrate. The pins can be moved vertically through the circular pedestal to lift the substrate from the pedestal. A ring is mounted around the pedestal and underneath the outer edge of the substrate. When the pins are protrude beyond the top surface of the circular pedestal the substrate is lifted and caused to tilt. The ring then is lifted to act on the outer edge of the rear surface of the substrate, thus separating the substrate from the circular pedestal and returning the substrate to a horizontal position.

Mechanism and method for mechanically removing a substrate

In a substrate processing apparatus, a substrate is processed to form a thin film thereon while it is maintained in the vertical direction, Furthermore, the rear surface of the substrate is cooled by a substrate cooling mechanism which contacts the rear surface thereof. The substrate cooling mechanism moves in a reciprocating fashion, whereas a substrate holder for holding the substrate moves both in horizontal and vertical directions.

Substrate processing apparatus including wafer transporting and

In an automatic loader for automatically loading a flat unprocessed substrate to a substrate processing apparatus for processing the flat substrate and automatically unloading a processed substrate, the automatic loader has: a plurality of cassette stages for vertically moving cassettes having a plurality of substrates held horizontally and parallel to each other; a first substrate convey mechanism contacting a single door of the substrate processing apparatus and forming a common conveyance path of all substrates; a single substrate posture control stage arranged in contact with the first convey mechanism to correct a posture of the substrate to be fed in the substrate processing apparatus; second substrate convey mechanisms for forming at least one conveyance path between the plurality of cassette stages and the substrate posture control stage and exchanging and conveying the substrate; and substrate counters arranged in the respective conveyance paths of the second substrate convey mechanisms. The processed substrates are returned to the original cassette.

Growing community of inventors

Fuchu, Japan

Yasuyuki Shirai