Tokyo Electron Limited

Yasuyuki Ido

Takehiko Orii

Naoki Shindo

Hisashi Kawano

Keisuke Egashira

Yosuke Hachiya

Shinichiro Shimomura

Kotaro Ooishi

Disclosed is a substrate liquid processing apparatus. The substrate liquid processing apparatus includes a processing unit, a nozzle, a silylation liquid supply mechanism, and a blocking fluid supply mechanism. The processing unit performs a water repellency imparting processing on a substrate by supplying a silylation liquid to the substrate. The nozzle includes an ejection port configured to supply the silylation liquid to the substrate positioned in the processing unit, and a silylation liquid flow path in which the silylation liquid flows toward the ejection port. The silylation liquid supply mechanism supplies the silylation liquid to the silylation liquid flow path in the nozzle through a silylation liquid supply line. The blocking fluid supply mechanism supplies a blocking fluid that blocks the silylation liquid within the silylation liquid flow path in the nozzle from an atmosphere outside the ejection port.

Substrate liquid processing apparatus having nozzle with multiple flow paths and substrate liquid processing method thereof

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Yamanashi, Japan

Yasuyuki Ido