Hitachi, Ltd.

Japan Nuclear Fuel Co., Ltd.

Yasuo Nakagawa

Takanori Ninomiya

Toshimitsu Hamada

Hiroshi Makihira

Nobuyuki Akiyama

Mineo Nomoto

Hiroya Koshishiba

Satoru Fushimi

Takashi Hiroi

Hitoshi Kubota

Yoshitada Oshida

Yukio Kembo

Koichi Sugimoto

Hisafumi Iwata

Kozo Nakahata

Makoto Udaka

Toshiaki Ichinose

Shunji Maeda

Hiroyuki Tanaka

Aizo Kaneda

Asahiro Kuni

Susumu Aiuchi

Yasuhiko Hara

Hideaki Doi

Keiya Saito

Kazushi Yoshimura

Tsutomu Mimata

Toshihiko Sakai

Tadashi Iida

Satoru Ezaki

Michinaga Kohno

Michio Takahashi

Souhei Ikeda

Kanji Ishige

Osamu Harada

Yoko Irie

Tooru Mita

Chie Yamanaka

Yasuhiro Fujishita

Kohichi Karasaki

Kouji Serizawa

Keizo Matsukawa

Shree K Nayer

A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.

Wiring pattern inspecting method and system for carrying out the same

A method for producing a thin film multilayer substrate having a base substrate, and, which a plurality of conductor pattern layers superposed thereon through dielectric layers therebetween comprises the steps of: optically detecting the uppermost conductor pattern layer whenever the conductor pattern layer is formed on the base substrate; inspecting an absence and/or presence of a fault of the conductor pattern layer; and repairing a faulty portion in accordance with fault position data detected by the inspecting. According to this method, it is possible to enhance a production yield of relatively large size of thin film multilayer substrates which needs a relatively small amount of production at a high production cost, for mounting LSI chips thereon.

Method for producing thin film multilayer substrate, and method and

The solid shape of an object is detected by viewing the objects along a Z-axis direction. A plurality of images of the object are picked up at different focus levels having correspondingly different Z-axis coordinate values. Focus measure values are calculated with respect to each of the pixels that are in each of the object images and that are designated by the same X- and Y-coordinate values. The focus measure values of the pixels in the object images having the same X- and Y-coordinate values are compared with each other to detect maximum focus measure values. The solid shape of the object is then estimated based on the Z-coordinate value of the focus level of the object image having the maximum detected focus measure values.

Method of detecting solid shape of object with autofocusing and image

The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.

Method of aligning and bonding tab inner leads

A pattern detection apparatus based on a scanning transmission electron microscope having an electron gun for generating and accelerating an electron beam, a plurality of convergent lenses for converging the electron beam, a deflection circuit for deflecting the electron beam so that it scans an object to be inspected, such as an X-ray mask, a detection circuit which receives electrons that have been dispersed and transmitted in the object and converts the detected electrons into an electrical signal, and an image forming circuit which forms a detected image of the object under test in response to the detected signal from the detection circuit and in synchronism with the deflection signal applied to the deflection circuit.

Apparatus and method of pattern detection based on a scanning

A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed. The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results. The area of the image of the filler is detected according to differences between the brightness of the board surface or of the via-hole wall and the brightness of the filler in the via-hole in the detected optical image, and whether the filler is lacking or not is decided according to the detection result.

Method for inspecting filled state of via-holes filled with fillers and

A pattern defect detecting method and apparatus are disclosed on a connectivity processor to input a binary picture signal pattern and a pad position coordinate and outputting connectivity data between pads. Here, the connectivity processing refers to a processing for giving the identical number to one aggregation of connected or linked pads for the pads given to a serial pattern. In the connectivity processor wherein a plane on which the drawn pattern to be inspected is scanned by a linear sensor, the connectivity processing can be releazed almost concurrently with the scanning by driving a temporary memory. Also, a pattern defect detecting apparatus the above-mentioned connectivity. The invention processing coping with the difficulties of a required inspection level, and also represents a processing time of each embodiment theoretically. A moving time of the bed on which an inspecting object is placed and others are added to the real processing time.

Pattern defects detection method and apparatus

In an X-ray tomographic imaging system and method, an object to be inspected is irradiated with X-rays from an X-ray source to obtain an X-ray transmission image of the object. The X-ray transmission image is converted by an X-ray fluorescence image intensifier into a detection image. The intensity of the detection image is also intensified by the X-ray fluorescence image intensifier. A photo-electric converter converts the intensified detection image from the X-ray fluorescence image intensifier into an electrical signal. The object to be inspected is held by an object holder rotatably at a position in proximity to the X-ray source and movably in a direction of the axis of rotation of the object and a direction perpendicular to the rotation axis. The electrical signal from the photo-electric converter is processed to a cross-sectional image.

X-ray tomographic imaging system and method

In accordance with the present invention, there is provided a pattern defect detecting apparatus using a scanning and transmission electron microscope, comprising an electron gun for accelerating an electron beam with high energy enough to transmit it through a sample and for radiating the accelerated electron beam, a condenser lens for focusing the electron beam generated by said electron gun, a beam deflection coil for deflecting the electron beam focused by said condenser lens, an objective lens for further focusing the electron beam deflected by said beam deflection coil onto a fixed spot, an XY stage for disposing the sample so as to be opposed to said objective lens, said XY stage being movable in X and Y directions in a step and repeat manner, a sample chamber for housing the XY stage in vacuum, said sample chamber including at least the outlet of the electron beam of said objective lens, an electron beam detector for detecting electron beams transmitted through said sample, said electron beam detector being fixed to a stationary member such as said chamber or a lens barrel, and defect detecting means for scanning the electron beam by using said beam deflection coil for each step and repeat operation of said XY stage, for comparing a video signal obtained from said electron beam detector with a reference pattern read out from memory means, and for thereby detecting a defect of the sample.

Method and apparatus for detecting defect in circuit pattern of a mask

Method of and apparatus for checking the geometry of multi-layer patterns for IC structures having identical functions, each of the multi-layer patterns including layer patterns arranged in different level layers, wherein electrical image signals corresponding to any two of the multi-layer patterns and having more than two levels are registered with each other and then compared to determine unmatched and matched portions. The comparison of the registered electric image signals may be performed with respect to their amplitude or their gradients. The registration and comparison of two electric image signals may be repeated for all of the layer patterns with the matched portions being no longer subjected to the registration and comparison. A defect detection signal is produced from finally unmatched portions, if any, of the electric image signals having undergone the said registration and comparison.

Method of and apparatus for checking geometry of multi-layer patterns

An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.

Apparatus and method for inspecting soldered portions

A printed circuit pattern inspection system, in which the optical image of circuit patterns is transformed into an electrical signal, the signal is converted into a binary digital signal, the connectivity relationship between selected two points of pattern in the form of binary signal is examined, connection data representative of the connectivity relationship and expressed by a pair of numbers given to the points is generated, and the connection data is compared with design data which is produced from design information and expressed in the form of a circulation list of numbers given to points in linkage relationship, whereby determination of defectiveness of patterns is made basing on the result of comparison.

Method and apparatus for detecting defects of printed circuit patterns

An object to be inspected which is jointed to a circuit board is vibrated in a contactless manner by applying a gas jet or a magnetic force to the object, a laser beam is irradiated on the object, and a laser beam reflected from the object is detected by a linear sensor to observe a laser speckle pattern for the object. Quality of a joint junction state of the object is judged from the laser speckle pattern.

Inspection method and apparatus for joint junction states

A method and an apparatus for detecting the position and posture of an object (5, 9, 10) are characterized by two planar light beams (3a, 3b) alternately projected on the object (5, 9, 10) to be handled and intersection lines (A, B) formed between the two planar light beams (3a, 3b) and the object (5, 9, 10) which are imaged by a single image pickup device (2) positioned between the two planar light beams (3a, 3b). A bright line occurring at a junction between an edge of the object and an intersection line is separated, extracted and transformed into an actual coordinate in a three dimensional coordinate system (x, y, z) by referring to corresponding relationships between the actual coordinate system (x, y, z) and a scanning coordinate system (i, j) so that the position and posture of the object (5, 9, 10) are detected in three dimensions.

Robot vision system

The present invention consists in a robot wherein a slit-light detector which is constructed of a light projector for projecting light so as to form a slit-light on an object to-be-handled and an image detector for detecting an image of the light-section waveform, is mounted on an operating member of the robot; means for scanning the slit-light detector is disposed; and the slit-light detector detects range data, on the basis of which a position, posture, inclination etc. of the object in a three-dimensional shape are detected, so that the robot can handle the object.

Robot system for recognizing three dimensional shapes

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Chigasaki, Japan

Yasuo Nakagawa