Fuji Photo Film Company, Limited

Fujifilm Corporation

Olin Microelectronic Chemicals, Inc.

Yasumasa Kawabe

Tadayoshi Kokubo

Toshiaki Aoai

Kenichiro Sato

Kazuya Uenishi

Shiro Tan

Kunihiko Kodama

Toru Fujimori

Shinji Sakaguchi

Takeshi Andou

Satoru Yamada

Daisuke Kashiwagi

Hideaki Ito

Shinji Fujimoto

Hisamitsu Tomeba

Hajime Nakao

Hiroshi Matsumoto

Shinichi Kanna

Junichi Fujimori

Kenji Honda

Hideyuki Nakamura

Syunichi Kondo

Tsukasa Yamanaka

Koji Shirakawa

Akira Nagashima

Fumiyuki Nishiyama

Hiroyuki Yonezawa

Kenichiro Satoh

Mokoto Momota

A pattern forming method includes forming a photosensitive resin composition layer on at least one surface of a substrate using a photosensitive transfer material, exposing the photosensitive resin composition layer; and developing the exposed photosensitive resin composition layer, in which the photosensitive transfer material includes a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, and the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).

Pattern forming method, etching method and method for producing capacitance-type input device

Provided are a photosensitive resin composition from which a cured product having a thin film thickness, excellent light-shielding properties, and a high surface hardness is obtained; as well as a cured product obtained by curing the photosensitive resin composition, a cured film and a method for producing the same, a method for producing a resin pattern, and a liquid crystal display device, an organic EL display device, an infrared cut filter, or a solid-state imaging device, each having the cured film. The photosensitive resin composition of the present invention includes (Component A) a polymer having a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group; (Component B) a photoacid generator; (Component C) a solvent; (Component D) a compound having a crosslinkable group and a molecular weight in the range of 100 to 2,000; and (Component S) titanium black.

Photosensitive resin composition, cured product and method for producing same, method for producing resin pattern, cured film, liquid crystal display device, organic el display device, infrared cut filter, and solid-state imaging device

A photosensitive transfer material including a support, a thermoplastic resin layer, and a photosensitive resin composition layer in this order, in which the photosensitive resin composition layer includes a polymer component (A) including a polymer having a constituent unit (a1) that includes a group in which an acid group is protected by an acid-decomposable group and a photoacid generator (B).

Photosensitive transfer material, pattern formation method, and etching method

Provided is a photosensitive resin composition from which a cured product having thin film thickness, excellent light-shielding properties, and high surface hardness is obtained. A a cured film and a method for producing the same, a method for producing a resin pattern, and an LCD device, an organic EL display device, an infrared cut filter, or a solid-state imaging device are also provided. The photosensitive resin composition includes a polymer component including at least one of categories (1) or (2), a photoacid generator, a solvent, and titanium black, wherein (1) includes (a1) a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group, and (a2) a constitutional unit containing a crosslinkable group, and (2) includes (a1) a constitutional unit containing a group in which an acid group is protected by an acid-decomposable group, and (a2) a constitutional unit containing a crosslinkable group.

There is provided that a method for producing a resin pattern, and the method includes at least the steps (1) to (7) in this order; (1) a coating step of coating a photosensitive resin composition on a substrate; (2) a solvent removal step of removing the solvent from the applied photosensitive resin composition; (3) an exposure step of patternwise exposing the photosensitive resin composition from which the solvent has been removed, to an active radiation; (4) a development step of developing the exposed photosensitive resin composition using an aqueous developer liquid; (5) an overcoating step of providing an overcoat layer on the developed photosensitive resin composition; (6) a heat-treating step of heat-treating the photosensitive resin composition on which the overcoat layer has been provided; and (7) a removal step of removing the overcoat layer.

Resin pattern, method for producing the pattern, method for producing MEMS structure, method for manufacturing semiconductor device, and method for producing plated pattern

A positive resist composition comprising the components of: (A) a compound capable of generating an acid upon irradiation with one of an actinic ray and a radiation; (B) a resin that is insoluble or slightly soluble in alkalis, but becomes alkali-soluble under an action of an acid; (C) a basic compound; and (D) a compound comprising at least three hydroxyl groups or at least three substituted hydroxyl groups, and comprising at least one cyclic structure.

Positive resist composition

A positive photosensitive composition comprising (A1) a compound that generates an aromatic sulfonic acid substituted with at least one fluorine atom and/or a group having at least one fluorine atom upon irradiation of an actinic ray or radiation, (B) a resin that has a monocyclic or polycyclic alicyclic hydrocarbon structure and is decomposed by the action of an acid to increase solubility in an alkali developing solution, and (C) a compound that has at least three hydroxy or substituted hydroxy groups and at least one cyclic structure or (A2) an onium salt of an alkanesulfonic acid in which the &#x3b1;-position of the sulfonic acid is not substituted with a fluorine atom and/or an onium salt of a carboxylic acid.

Positive photosensitive composition

Provided is a positive photosensitive resin composition comprising (A) a polymer which has alicyclic hydrocarbon skeleton and decomposes under the action of an acid to be rendered soluble in alkali, (B) a compound which generates an acid upon irradiation with actinic rays, (C) a nitrogen-containing basic compound, (D) at least one of a fluorine-containing surfactant and a silicon-containing surfactant and (E) a solvent. The composition can exhibit better characteristics when the solvent (E) is a combination of specified solvents.

Positive photosensitive resin composition

Provided is a positive photosensitive resin composition comprising (A) a polymer which has alicyclic hydrocarbon skeletons and composes under the action of an acid to be rendered soluble in alkali, (B) a compound which generates an acid upon irradiation with actinic rays, (C) a nitrogen-containing basic compound, (D) at least one of a fluorine-containing surfactant and a silicon-containing surfactant and (E) a solvent. The composition can exhibit better characteristics when the solvent (E) is a combination of specified solvents.

A positive photoresist composition comprising the components of: (a) a resin which decomposes by the action of an acid, thereby having an increased solubility in an alkali developer; and (b) a compound which is represented by the formula (1) and generates an acid by exposure to active rays or radiation, and a compound which is represented by the formula (2) and generates an acid by exposure to active rays or radiation.

Positive photoresist composition

A positive resist composition comprises: (A) a resin having an aliphatic cyclic hydrocarbon group and increasing the solubility to an alkali developer by the action of an acid; (B) a compound generating an acid upon irradiation with an actinic ray or radiation; and (C) a nitrogen-containing compound having in the molecule at least one partial structure represented by following formula (I).

Disclosed is a positive-working photoresist composition having reduced development defects, and excellent in resist pattern profiles and in the resolving power of contact holes, which comprises (i) a compound generating an acid by irradiation of active light or radiation, and (ii) a resin containing repeating units of at least one kind selected from the group consisting of (a) repeating units having alkali-soluble groups each protected with at least one group selected from the group consisting of groups containing alicyclic hydrocarbon structures represented by specific general formulas (pI) to (pVI), (b) repeating units represented by specific general formula (II) and (c) repeating units represented by specific general formulas (III-a) to (III-d), and decomposed by the action of an acid to increase the solubility of the resin into an alkali.

Positive-working photoresist composition

The present invention provides a positive photosensitive resin composition which, when exposed to far ultraviolet rays, in particular, ArF excimer laser light, shows excellent performances especially with respect to the residual film ratio, resist profile, resolution, and dry-etching resistance and does not pose the problem of development defects. The positive photosensitive resin composition comprising: (A) a compound which generates an acid upon irradiation with actinic rays, (B) a polymer having specific structures represented by formula (Ia), (Ib), (Ic) or (Id) defined in the specification, (C) a nitrogen-containing basic compound, and (D) at least one of a fluorine type surfactant and a silicone type surfactant.

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Shizuoka, Japan

Yasumasa Kawabe