Tokyo Ohka Kogyo Co., Ltd.

Tokyo Ohka Co., Ltd.

Yasuhiro Yoshii

Yoshiyuki Utsumi

Yoichi Hori

Masaru Takeshita

Takahiro Kojima

Hideo Hada

Tsuyoshi Nakamura

Hiroaki Shimizu

Masahito Yahagi

Kyoko Ohshita

Takeshi Iwai

Kotaro Endo

Fumitake Kaneko

Keita Ishiduka

Makiko Irie

Kensuke Matsuzawa

Jiro Yokoya

Hitoshi Yamano

Hirokuni Saito

Akiya Kawaue

Tsuyoshi Kurosawa

Daisuke Kawana

Yosuke Suzuki

Shinji Kumada

Mari Murata

Takehito Seo

Yoshiyuki Utumi

A resist composition that generates an acid upon exposure and whose solubility in a developing solution is changed by action of an acid, the resist composition containing a base material component whose solubility in a developing solution is changed by action of an acid, and a compound represented by General Formula (e1) in which Rdrepresents a monovalent organic group and Rdrepresents a single bond or a divalent linking group

Resist composition and method of forming resist pattern

A resist composition which generates an acid upon exposure and whose solubility in a developing solution is changed due to an action of the acid, the resist composition including a base material component whose solubility in a developing solution is changed due to the action of an acid, an acid generator component which generates an acid upon exposure, and an organic acid which contains at least one carboxy group, in which the acid generator component contains a compound represented by formula (b1) in which Rto Rrepresent an aryl group, an alkyl group, or an alkenyl group. Rto Rhave a total of four or more substituents containing fluorine atoms, Xrepresent an n-valent anion, and n represents an integer of 1 or greater. 

A resist composition including a compound (D0) represented by general formula (d0) and a resin component (A1) has a structural unit (a0) in which a compound represented by general formula (a0-1) has a polymerizable group within the Wportion converted into a main chain (in formula (d0), Rdrepresents a fluorine atom or a fluorinated alkyl group; In formula (a0-1), Wrepresents a polymerizable group-containing group; Crepresents a tertiary carbon atom, and the &#x3b1;-position of Cis a carbon atom which constitutes a carbon-carbon unsaturated bond; Rrepresents an aromatic hydrocarbon group; or a chain hydrocarbon group; Rand Reach independently represents a chain hydrocarbon group, or Rand Rare mutually bonded to form a cyclic group). 

A resist composition including a resin component whose solubility in a developing solution is changed due to the action of the acid, in which the resin component has a constitutional unit derived from a compound represented by Formula (a0-1) and a constitutional unit containing an acid decomposable group whose polarity is increased due to the action of the acid. In the formula, W represents a polymerizable group-containing group, Yarepresents a carbon atom, Xarepresents a group that forms a monocyclic aliphatic hydrocarbon group together with Ya, some or all hydrogen atoms in the monocyclic aliphatic hydrocarbon group may be substituted with substituents, and Rarepresents an aromatic hydrocarbon group which may have a substituent. 

A resist composition including a compound (D0) formed of an anion moiety and a cation moiety which is represented by Formula (d0), and a resin component (A1) which has a constitutional unit (a0) obtained from a compound represented by Formula (a0-1), in which a polymerizable group at a W portion is converted into a main chain, and a constitutional unit (a1) containing an acid decomposable group whose polarity is increased due to an action of an acid. In Formula (d0), Rrepresents a substituent and n represents an integer of 2 or greater. In Formula (a0-1), Warepresents an (n+1)-valent aromatic hydrocarbon group which may have a substituent. 

A resist composition including a resin component whose solubility in a developing solution is changed due to an action of an acid, in which the resin composition has a constitutional unit derived from a compound containing a chain-like aliphatic acid dissociable group or a monocyclic aliphatic acid dissociable group and a constitutional unit derived from a compound containing an aromatic hydrocarbon group-containing acid dissociable group.

A resist composition including a base component which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component which generates acid upon exposure, the acid-generator including an acid generator consisting of a compound represented by general formula (b1-1) shown below: In which Rrepresents a hydrocarbon group which may have a substituent exclusive of a nitrogen atom; each of Qand Qindependently represents a single bond or a divalent linkage group; Yrepresents an alkylene group or fluorinated alkyl group of 1 to 4 carbon atoms; and Zrepresents an organic cation exclusive of an ion represented by general formula (w-1).

Compound and method of producing the same, acid generator, resist composition and method of forming resist pattern

A resist composition including a base component (A) which exhibits changed solubility in an alkali developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including an acid generator (B1) consisting of a compound represented by general formula (b1-1) shown below: wherein Rrepresents a hydrocarbon group which may have a substituent exclusive of a nitrogen atom; each of Qand Qindependently represents a single bond or a divalent linkage group; Yrepresents an alkylene group or fluorinated alkyl group of 1 to 4 carbon atoms; and Zrepresents an organic cation exclusive of an ion represented by general formula (w-1).

A resist composition for immersion exposure, including: a base component (A) which exhibits changed solubility in an alkali developing solution under action of an acid, and contains no structural unit (c1) represented by the general formula (c1-1) shown below; an acid generator component (B) which generates an acid upon exposure; and a fluorine-containing resin component (C) which contains the structural unit (c1) (in the formula (c1-1), R represents a hydrogen atom, a lower alkyl group, a halogen atom, or a halogenated lower alkyl group; Rrepresents a fluorinated alkyl group; and Yrepresents an alkylene group).

Resist composition for immersion exposure and method of forming resist pattern

There are provided a method of forming a resist pattern in which a resist pattern is formed on top of a substrate by using a chemically amplified resist composition and conducting patterning two or more times, the method being capable of reducing the extent of damage, caused by the second patterning, imposed upon the first resist pattern that is formed by the first patterning; as well as a resist composition that is useful for forming the first resist pattern in this method of forming a resist pattern. The method includes forming of a first resist pattern using a resist composition containing a thermal base generator as a chemically amplified resist composition during first patterning, and then conducting a hard bake for baking the first resist pattern under a bake condition such that a base is generated from the thermal base generator, prior to the second patterning.

Method of forming resist pattern and resist composition

A resist composition for immersion exposure including: a base component (A) which exhibits changed solubility in an alkali developing solution under the action of acid; an acid-generator component (B) which generates acid upon exposure; and a fluorine-containing resin component (F); dissolved in an organic solvent (S), the fluorine-containing resin component (F) including a structural unit (f1) containing a fluorine atom, a structural unit (f2) containing a hydrophilic group-containing aliphatic hydrocarbon group, and a structural unit (f3) derived from an acrylate ester containing a tertiary alkyl group-containing group or an alkoxyalkyl group.

Resist composition for immersion exposure, method of forming resist pattern, and fluorine-containing resin

Positive resist composition and method of forming resist pattern

A positive resist composition including: a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid; and an acid-generator component (B) which generates acid upon exposure; dissolved in an organic solvent (S), the organic solvent (S) including an alcohol-based organic solvent having a boiling point of at least 150&#xb0; C.; and a method of forming a resist pattern including: applying the positive resist composition on a substrate on which a first resist pattern is formed to form a second resist film; and subjecting the second resist film to selective exposure and alkali developing to form a resist pattern.

There are provided a compound preferable as an acid generator for a resist composition, an acid generator including the compound, a resist composition containing the acid generator, and a method of forming a resist pattern using the resist composition, and the compound is represented by general formula (b1-12) shown below:R&#x2014;CH&#x2014;O&#x2014;Y&#x2014;SOA&#x2003;&#x2003;(b1-12)

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Kawasaki, Japan

Yasuhiro Yoshii