Tokyo Electron Limited

Yasuhiro Kuga

Yukinobu Otsuka

Shinsuke Takaki

Masatoshi Kaneda

Kouichi Mizunaga

Kouichirou Tanaka

Mitsuhiro Tanoue

Koji Ushimaru

Ryohei Fujise

Shinichi Sagara

A substrate processing apparatus includes: a heat processing unit configured to perform a heat process on a substrate having a film formed on the substrate; and a control unit configured to control the heat processing unit, wherein the heat processing unit comprises: a heater configured to support and heat the substrate; a chamber configured to cover the substrate supported on the heater; a gas ejector having a head in which ejection holes are formed, and configured to eject a gas from the ejection holes toward a surface of the substrate; an outer peripheral exhauster configured to evacuate a processing space inside the chamber from an outer peripheral region located further outward than a peripheral edge of the substrate supported on the heater; and a central exhauster configured to evacuate the processing space from a central region located further inward than the peripheral edge of the substrate supported on the heater.

Substrate processing apparatus, substrate processing method, and storage medium

A heat treatment apparatus for heating, in a treatment container, a substrate on which a coating film is formed. The heat treatment apparatus includes: a mount provided in the treatment container and which mounts the substrate thereon; a heating part that heats the substrate mounted on the mount; a suction pipe leading to a suction port formed in the mount, penetrating the mount, and extending directly downward; and a collection container provided on a suction path between the suction pipe and a suction mechanism. The collection container is provided directly below the mount in plan view and connected to the suction pipe to collect a sublimate in the treatment container.

Heat treatment apparatus and heat treatment method

A substrate cooling apparatus is configured to include: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface for supporting a rear surface of the substrate; a coolant flow path through which a coolant flows, provided in the mounting table for cooling the mounting surface; a plurality of gas discharge ports provided in a circumferential direction at a peripheral edge portion of the mounting surface for discharging a cooling gas for cooling the substrate; a gas suction port provided at a center portion of the mounting surface for sucking the cooling gas; and a groove provided in the mounting surface for diffusing the cooling gas in a circumferential direction of the substrate. The substrate cooling apparatus configured as described above can cool the substrate mounted on the mounting surface with high uniformity.

Substrate cooling apparatus, substrate cooling method, and storage medium

Heat processing apparatus of substrate

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Koshi, Japan

Yasuhiro Kuga