Applied Materials Israel Limited

Yariv Simovitch

Ron Naftali

Ido Almog

Amir Shoham

Ido Dolev

Guy Shwartz

Disclosed herein is s computer-based method for obtaining and analyzing multi-die scan data of a patterned wafer. The method includes sequentially implementing an operation of scanning a respective plurality of sets of slices on a wafer, and, per each slice segment in a multiplicity of slice segments in the plurality of sets of slices, an operation of performing die-to-multi-die (D2MD) analysis of scan data of the slice segment in order to detect defects in the slice segment. Each set of slices may constitute a subset of the totality of slices on the respective die-column. Sets scanned in a same implementation are analogous to one another, thereby facilitating&#x2014;in the die-to-multi-die analysis of scan data of a slice segment&#x2014;taking into account, as reference, scan data of areas on other die-columns, which were scanned in the same implementation.

Die-to-multi-die wafer inspection

Disclosed herein is a computer-implemented method for generating calibration data usable for analysis of a sample. The method includes: (i) identifying targets in an image frame pertaining to a scanned area of a sample; (ii) computing displacements of the targets relative to positions thereof as given by, or derived from, reference data of the scanned area; (iii) based at least on the computed target displacements, determining values of coordinate transformation parameters (CTPs) relating coordinates of the image frame to coordinates of the scanned area as given by, or derived from, the reference data; and (iv) using at least the CTPs to obtain displacements of multiple segments in the image frame, thereby generating a displacement mapping of the image frame or at least a part thereof.

Methods and systems for generating calibration data for wafer analysis

A computer program product, a computerized method for configuring an inspection system and an inspection system. The inspection system may include an image acquisition module that comprises illumination optics and collection optics, a controller; and a processor. The image acquisition module may be arranged to acquire a group of first images of an object segment. Different first images of the group of first images are acquired while the inspection system is configured with different polarization configurations that belong to a first group of polarization configurations. The processor may be arranged to determine polarization parameters of different points within the object segment; wherein the determining is based on the group of first images and the different polarization configurations and calculate, based on the polarization parameters of the different points, a group of second images of the object segment that would be acquired when the inspection system is configured according to different polarization configurations that belong to a second group of polarization configurations.

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Rehovot, Israel

Yariv Simovitch