Mattson Technology, Inc

Yaozhi Hu

Ashok K Sinha

Stephen E Savas

Paul Janis Timans

Zsolt Nenyei

Wilfried Lerch

Bruce W Peuse

Guangcai Xing

Sing-Pin Tay

Georg Roters

Plasma assisted low temperature radical oxidation is described. The oxidation is selective to metals or metal oxides that may be present in addition to the silicon being oxidized. Selectivity is achieved by proper selection of process parameters, mainly the ratio of H2 to O2 gas. The process window may be enlarged by injecting H2O steam into the plasma, thereby enabling oxidation of silicon in the presence of TiN and W, at relatively low temperatures. Selective oxidation is improved by the use of an apparatus having remote plasma and flowing radicals onto the substrate, but blocking ions from reaching the substrate.

Method and apparatus for growing thin oxide films on silicon while minimizing impact on existing structures

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San Jose, CA, United States of America

Yaozhi Hu