Acm Research (shanghai) Inc.

Acm Research, Inc.

Telefonaktiebolaget Lm Ericsson (publ)

Xuejun Li

Xi Wang

Fuping Chen

Xiaoyan Zhang

Jun Wang

Jian Wang

Zhaowei Jia

Yinuo Jin

Fufa Chen

Hui Wang

Liangzhi Xie

Shena Jia

Jun Wu

Xiaofeng Tao

Lei Zhu

Zhenming Chu

Howard Wang

A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency fand power Pto drive the ultra/mega sonic device; before bubble cavitation in the liquid damaging patterned structure on the substrate, setting the ultra/mega sonic power supply at zero output; after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency fand power Pagain; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time τ, or comparing the detected power off time with a preset time τ, or comparing detected amplitude of each waveform with a preset value, if the detected power on time is longer than the preset time τ, or the detected power off time is shorter than the preset time τ, or the detected amplitude of any waveform is larger than the preset value, shut down the ultra/mega sonic power supply and send out an alarm signal.

Methods and apparatus for cleaning semiconductor wafers

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

System for cleaning semiconductor wafers

The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency fand power Pagain; repeating above steps till the substrate being cleaned.

Methods and apparatus for cleaning substrates

A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Method for cleaning semiconductor wafers

A method for effectively cleaning vias (), trenches () or recessed areas on a substrate () using an ultra/mega sonic device (), comprising: applying liquid () into a space between a substrate () and an ultra/mega sonic device (); setting an ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device (); after the ratio of total bubbles volume to volume inside vias (), trenches () or recessed areas on the substrate () increasing to a first set value, setting said ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device (); after the ratio of total bubbles volume to volume inside the vias (), trenches () or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency fand power Pagain; repeating above steps till the substrate () being cleaned.

A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency fand power Pagain; repeating above steps till the substrate being cleaned. Normally, if f=f, then Pis equal to zero or much less than P; if P=P, then fis higher than f; if the f&#x3c;f, then, Pcan be either equal or less than P.

Methods and system for cleaning semiconductor wafers

An apparatus for cleaning semiconductor substrates including a chamber, a chuck, a liquid collector, an enclosing wall, at least one driving mechanism, at least one internal dispenser, and at least one external dispenser. The chamber has a top wall, a side wall and a bottom wall. The chuck is disposed in the chamber. The liquid collector surrounds the chuck. The enclosing wall surrounds the liquid collector. The driving mechanism drives the enclosing wall to move up and down, wherein when the enclosing wall is driven to move up, a seal room is formed by the liquid collector, the enclosing wall, the top wall and bottom wall of the chamber. The internal dispenser is disposed inside the seal room. The external dispenser is disposed outside the seal room and capable of getting in and out of the seal room after the enclosing wall is driven to move down.

Apparatus for cleaning semiconductor substrates

A method for cleaning a semiconductor substrate without damaging its patterned structure via an ultra/mega sonic device comprises applying liquid into a space between the substrate and the sonic device; setting an ultra/mega sonic device power supply at a frequency fand power P; and at zero output before bubble cavitation occurs; followed by at fand Pagain after bubble temperature is lowered; detecting power on time (at P, f), power off time or amplitude of each waveform output by the power supply; comparing the detected power on time with a preset time T, power off time with a preset time &#x3c4;, amplitude of each waveform with a preset value, if the detected power on time is longer than &#x3c4;, or power off time is shorter than &#x3c4;, or amplitude of any waveform is larger than the preset value, shut down the power supply and send out an alarm.

The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency fand power Pto drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency fand power Pagain; repeating above steps till the substrate being cleaned.

A fall-proof apparatus for cleaning semiconductor devices is provided. The fall-proof apparatus comprises: a nozzle () connecting with a carrier (); a megasonic/ultrasonic device () fixing on the carrier (); and a sensor () detecting the distance between the megasonic/ultrasonic device () and the carrier () to determine whether the megasonic/ultrasonic device () is loose and going to fall. The megasonic/ultrasonic device works with the nozzle during a cleaning process. A chamber with the fall-proof apparatus is also provided.

Fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus

A method and system of provisioning one or more Network Elements, as well as a method and apparatus for resuming a failed Customer Service Order for provisioning one or more Network Elements, is disclosed. A provisioning logic framework receives a Customer Service Order CSO from a Business Support System, calls respective provisioning logic for performing said Customer Service Order and detects if the received Customer Service Order is a CSO to be resumed. During the performing time of said Customer Service Order, historical processing data is stored. If it is detected that the received Customer Service Order is a CSO to be resumed, the provisioning logic framework builds up a fake environment on the basis of historical processing data stored previously for the CSO to be resumed. Then the successful part of the CSO is directed to the fake environment and the uncompleted part of the CSO is directed to actual Network elements.

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Shanghai, China

Xuejun Li