Applied Materials, Inc.

Avery Dennison Corporation

Xiaoming He

Kenneth S Collins

Jennifer Y Sun

Andrew Nguyen

Xikun Wang

Meihua Shen

Ren-Guan Duan

Senh Thach

Jie Yuan

Changhun Lee

Thomas Allen Graves

Ali Reza Mehrabi

Stephen Li

Haochuan Wang

Kouroche Kian

In-situ low pressure chamber cleans and gas nozzle apparatus for plasma processing systems employing in-situ deposited chamber coatings. Certain chamber clean embodiments for conductor etch applications include an NF-based plasma clean performed at pressures below 30 mT to remove in-situ deposited SiOcoatings from interior surfaces of a gas nozzle hole. Embodiments include a gas nozzle with bottom holes dimensioned sufficiently small to reduce or prevent the in-situ deposited chamber coatings from building up a SiOdeposits on interior surfaces of a nozzle hole.

Method and apparatus for reducing particle defects in plasma etch chambers

Specialty ceramic materials which resist corrosion/erosion under semiconductor processing conditions which employ a corrosive/erosive plasma. The corrosive plasma may be a halogen-containing plasma. The specialty ceramic materials have been modified to provide a controlled electrical resistivity which suppresses plasma arcing potential.

Method of reducing plasma arcing on surfaces of semiconductor processing apparatus components in a plasma processing chamber

Plasma-resistant ceramics with controlled electrical resistivity

A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

Method and apparatus for linear die transfer

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Arcadia, CA, United States of America

Xiaoming He