Samsung Electronics Co., Ltd.

Samsung Austin Semiconductor, LP

Woosung Han

Sangjun Choi

Hyosan Lee

Changki Hong

Hyungho Ko

Donggyun Han

Amuldeep S Brar

Hyoungdo Kim

Sihyeung Lee

Nampyo Lee

A system and method concurrently processes multiple wafers. A cassette structure includes multiple chucks and a drive spool for supporting and rotating the chucks. Each chuck holds a wafer in position while rotating. The cassette structure is loaded into a process chamber. Each chuck includes a self-locking mechanism that is activated by the centrifugal force generated from the rotation of the chuck. The self-locking mechanism centers and holds a wafer in position with respect to the chuck. A drive motor drives the drive spool, which causes the chucks to rotate. As the chucks are being rotated, a dispensing assembly delivers a processing chemical to the wafers.

Parallel multi wafer axial spin clean processing using spin cassette inside movable process chamber

An apparatus and method for removing photoresist from a substrate, which includes treating the photoresist with a first reactant to cause swelling, cracking or delamination of the photoresist, treating the photoresist with a second reactant to chemically alter the photoresist, and subsequently removing the chemically altered photoresist with a third reactant. In one example, the first reactant is supercritical carbon dioxide (SCCO), the second reactant is ozone vapor, and the third reactant is deionized water.

Apparatus and method for removing photoresist from a substrate

A resist pattern can be formed on a microelectronic substrate, the resist pattern comprising a resist material. A coating layer, including a water-soluble resin, is formed on the resist pattern, wherein the water-soluble resin and the resist material are miscible with one another and intermix to provide an intermixed layer comprising the resist material and the water-soluble resin between the resist pattern and a non-intermixed coating layer. The intermixed layer can be hardened and the non-intermixed coating layer can be removed from the hardened intermixed layer.

Methods of fabricating microelectronic features by forming intermixed layers of water-soluble resins and resist materials

Growing community of inventors

Seoul, South Korea

Woosung Han