International Business Machines Corporation

William Y Chang

Jeanne P Bickford

Alan Weger

Kerry A Kravec

Wing L Lai

Sebnem Jaji

Sharon Lynne Von Bruns

Thomas S Barnett

Brian M Trapp

Rashmi D Chatty

Gie Lee

A semiconductor wafer is provided with one or more parameter scaling metric (PSM) groupings. Each PSM grouping includes a first device having a known active region geometry and further includes a set of one or more devices having active region geometry dimensions in a known relationship with the active region geometry of the first device. One or more parameter scaling metrics are calculated using measured values of one or more active region parameters of interest. The parameter scaling metric(s) can be used to quantify the stability and uniformity of a fabrication process used to make the semiconductor wafer.

Structure and method for monitoring variation within an active region of a semiconductor device using scaling

A method of modeling yield for semiconductor products includes determining expected faults for each of a plurality of library elements by running a critical area analysis on each of the library elements, and assessing, from the critical area analysis, an expected number of faults per unit area, and comparing the same to actual observed faults on previously manufactured semiconductor products. Thereafter, the expected number of faults for each library element is updated in response to observed yield. A database is established, which includes the die size and expected faults for each of the library elements. Integrated circuit product die size is estimated, and library elements to be used to create the integrated circuit die are selected. Fault and size data for each of the selected library elements are obtained, the adjusted estimated faults for each of the library elements are summed, and estimated yield is calculated.

Equivalent gate count yield estimation for integrated circuit devices

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William Y Chang