E.i. Dupont De Nemours and Company

William L Hamilton

Richard Douglas Bauer

Gwendyline Y Chen

A process for electrodepositing a coating on an electroconductive article employed as an anode by immersing the electroconductive article in a photoimageable electrodeposition coating composition comprising an aqueous dispersion of (a) a water-soluble or water-dispersible polymer having an acid value of 20 to 300, and a number average molecular weight of not less than 300 with the proviso that when the polymer is unsaturated, it has an unsaturated equivalent of 150 to 3000, and when the polymer is saturated it is used in combination with an ethylenically unsaturated compound; (b) an initiator or initiating system, and (c) a defined metal salt of a .beta. diketone.

Process for electrodeposition of resist formulations which contain metal

The present invention provides an aqueous-processable, positive-working photoresist composition having improved photospeed and aqueous development rate without substantially reducing processing latitude in printed circuit chemistries. The compositions contain (a) a polymeric material having a polymer backbone with pendant acid labile groups which are bound directly or indirectly to the polymer backbone, and free acid groups, wherein the polymeric material has an acid number of about 25 and is substantially insoluble in 1% by weight aqueous sodium carbonate solution at 30.degree. C., and (b) a substance that forms an acid upon exposure to actinic radiation. The positive photoresists of this invention may be used to prepare printed circuits wherein the photoresist may be applied to the printed circuit substrate as a liquid coating, as a solid, dry film or from an electrodeposition bath.

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Chesapeake City, MD, United States of America

William L Hamilton