Arch Specialty Chemicals, Inc.

Olin Microelectronic Chemicals, Inc.

Fujifilm Electronic Materials U.s.a., Inc.

Microchem Inc.

Kayaku Advanced Materials, Inc.

Hewlett-packard Development Company, L.P.

Nippon Kayaku Co., Ltd

William D Weber

Ahmad A Naiini

Pamela J Waterson

Steve Lien-Chung Hsu

Richard Hopla

Ilya Rushkin

Andrew J Blakeney

Donald W Racicot

Steve L Hsu

Daniel J Nawrocki

David B Powell

Jeremy V Golden

Il'ya Rushkin

Pamela D Waterson

Satoshi Mori

Sanjay Malik

Thomas R Strand

Nao Honda

Donald W Johnson

Jon Metivier

Vincent R Urdi

Milton O Bernal

Andrew J Roza

Don Perry

Laurie J Peterson

Joseph R Molea

Steve Lien-Chun Hsu

Richard J Hopla

The present invention is directed to a permanent epoxy photoresist composition useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more epoxy resins according to Formulas I-VI, (B) one or more cationic photoinitiators; (C) one or more film casting solvents; and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed composition.

Epoxy formulations and processes for fabrication of relief patterns on low surface energy substrates

The present invention is directed to a permanent photoimageable compositions and the cured products thereof useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more alkali soluble, film forming resins or one or more film forming resins that become soluble in alkali solutions by action of an acid, (B) one or more cationic photoinitiators, (C) one or more film casting solvents, and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed compositions.

Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates

The present disclosure relates to compositions that include at least one polybenzoxazole precursor polymer, at least one photoacid generator, and at least one basic compound. Articles, films, and methods related to these compositions are also disclosed.

Positive photosensitive resin compositions

A heat resistant positive-working photosensitive PBO precursor composition comprising:

Positive photosensitive polybenzoxazole precursor compositions

A photoimagable composition suitable for use as a negative photoresist comprising:

Photoimageable coating composition and composite article thereof

An edge bead remover composition that includes at least one ketone selected from the group consisting of: wherein Rand Rare independently selected from the group consisting of:

Semiconductor stress buffer coating edge bead removal compositions and method for their use

Photoresist compositions that demonstrate superior photolithographic performance and hardened resist films that show superior resistance to solvents, have excellent resistance to under plating during the electrodeposition of metals, and show excellent resist stripping characteristics. These photoresist compositions according to the invention are well-suited as for applications in the manufacture of MEMS and micromachine devices. These photoresist compositions according to the invention comprise one or more epoxide-substituted, polycarboxylic acid Resin Component (A), one or more photoacid generator compounds (B), and one or more solvent (C).

Photoresist compositions, hardened forms thereof, hardened patterns thereof and metal patterns formed using them

A positive photosensitive resin composition comprising:  

Photosensitive resin compositions

An end-capped polybenzoxazole precursor having acid labile functional groups, positive working photosensitive compositions thereof and use of the compositions for producing heat resistant relief images on substrates.

A heat resistant negative working photosensitive composition that comprises 

A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.

Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images. The non-photosensitive polyimide precursor compositions comprise

Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems

A heat resistant negative working photosensitive composition that comprises

Reducing inhibition of the photochemical crosslinking by including in the photosensitive polyimide precursor composition a metal inhibitor selected from 1H-tetrazole, 1,2-cyclohexenediamine tetraacetic acid hydrate and 5-mercaptobenzimidazole.

Growing community of inventors

Rumford, RI, United States of America

William D Weber