Applied Materials, Inc.

William Allan Bagley

Paohuei Lee

Kyung-Tae Kim

Makoto Inagawa

Sam Hyungsam Kim

Takayuki Matsumoto

James Hoffman

Toshio Kiyotake

Billy C Leung

Sam-Kyung Kim

Jonathan Erik Larson

Suhail Anwar

Janusz Jozwiak

Su Ho Cho

Samuel Leung

A substrate support assembly and method for controlling the temperature of a substrate within a process chamber with a temperature uniformity of +/&#x2212;5&#xb0; C. are provided. A substrate support assembly includes a thermally conductive body comprising an aluminum material, a substrate support surface on the surface of the thermally conductive body and adapted to support the large area glass substrate thereon, one or more heating elements embedded within the thermally conductive body, and one or more cooling channels embedded within the thermally conductive body and positioned around the one or more heating elements. A process chamber comprising the substrate support assembly of the invention is also provided.

Active cooling substrate support

An apparatus and method incorporating at least two sensors that detect the presence of a substrate is provided. In one embodiment, a method for transferring a substrate in a processing system is described. The method includes positioning a substrate on an end effector in a first chamber, moving the substrate through an opening between the first chamber and a second chamber along a substrate travel path, and sensing opposing sides of the substrate travel path using at least two sensors positioned proximate to the opening, each of the at least two sensors defining a beam path that is directed through opposing edge regions of the substrate when at least a portion of an edge region traverses the beam path.

Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate

Systems, methods, and apparatus are provided for including a chip embedded in components of electronic device manufacturing systems adapted to sense, store, and/or update at least one of identification, operational-related and process-related information associated with the components. In other aspects of the invention, a processing chamber component having an embedded chip with storage capacity is adapted to record at least one of identification, operational-related and process-related information associated with the component; and to communicate the information from the chip to enable determination of an operational state of the component. Numerous other aspects are disclosed.

Electronic device manufacturing component with an embedded chip and methods of using the same

An apparatus and method incorporating at least two sensors that detect the presence of substrate defects, such as breakage or misalignment, along the lengths of at least two parallel edges of a moving substrate. In one embodiment, an apparatus for detecting substrate defects includes a sensor arrangement including at least two sensors that continuously sense a substrate near at least two parallel edges of the substrate as the substrate passes the sensors. In another embodiment, an apparatus for detecting substrate defects includes a robot having a substrate support surface, and a sensor arrangement including at least two sensors that continuously sense a substrate near at least two parallel edges of the substrate during substrate transfer on the substrate support surface. In another embodiment, a method of continuously detecting substrate defects includes positioning at least two sensors to continuously sense a substrate near at least two parallel edges of the substrate as the substrate passes the sensors, and transmitting a signal from each of the at least two sensors to a controller that continuously monitors the signals from the at least two sensors to detect the presence of a substrate defect.

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Tokyo, Japan

William Allan Bagley