Acm Research (shanghai) Inc.

Wenjun Wang

Hui Wang

Fuping Chen

Xiaoyan Zhang

Fufa Chen

Hongchao Yang

Jun Wu

Shu Qing Yang

Voha Nuch

Zhiyou Fang

Jun Wang

Jian Wang

He Wang

Shena Jia

Ting Yao

Deyun Wang

Guangyu Xia

Huaidong Zhang

Methods and an apparatus for removing particles or photoresist on substrates. In an embodiment, a method comprises the following steps: transferring one or more substrates into a DIOsolution accommodated in a DIObath; after the one or more substrates are processed in the DIObath, taking the one or more substrates out from the DIObath and transferring the one or more substrates into a SPM solution accommodated in a SPM bath; after the one or more substrates are processed in the SPM bath, taking the one or more substrates out from the SPM bath and rinsing the one or more substrates; and transferring the one or more substrates to one or more single chambers to perform single substrate cleaning and drying process. The method combines DIOand SPM in one cleaning sequence, which can remove particles or photoresist, especially remove photoresist treated by medium dose or high dose of ion implantation.

Method and apparatus for removing particles or photoresist on substrates

A coater with automatic cleaning function and a coater automatic cleaning method. The coater () includes a coater chamber () capable of being filled up with cleaning solution, a substrate chuck () holding and positioning a substrate (), and at least one shroud () capable of moving up for preventing photoresist from splashing out of the coater chamber (), or moving down and immersing into the cleaning solution for cleaning. The coater () automatic cleaning method includes the following steps: turning off a liquid outlet valve (A,B,) of the coater (); filling up a coater chamber () with cleaning solution; after photoresist in the coater chamber () being dissolved into the cleaning solution, turning on the liquid outlet valve (A,B,) and draining the cleaning solution out of the coater chamber ().

Coater with automatic cleaning function and coater automatic cleaning method

A method for cleaning a substrate with pattern structures comprises the following steps: using gas-liquid atomization to clean a substrate surface (); using TEBO megasonic to clean the substrate surface (); and drying the substrate (). The TEBO megasonic cleaning is used to remove small size particles on the substrate and the gas-liquid atomization cleaning is used to remove large size particles on the substrate. The method enables achieving an effect of cleaning the substrate without or with less device damage. A substrate cleaning apparatus is also provided.

Substrate cleaning method and apparatus

The present invention provides a substrate heat treatment apparatus for heat treating a substrate, including a bake plate, support components, a baffle plate, and a driving device. The bake plate defines at least one gas passage. The support components support the substrate. The baffle plate is fixed on a top surface of the bake plate. The baffle plate surrounds the substrate and a gap is formed between an inner circumferential wall of the baffle plate and the substrate. A driving device drives the plurality of support components to move up or down. When heat treating the substrate, a hot gas is supplied to the space between the substrate and the top surface of the bake plate through the gas passage of the bake plate, and the hot gas flows out through the gap formed between the inner circumferential wall of the baffle plate and the substrate.

Substrate heat treatment apparatus

A substrate supporting apparatus () for cleaning a back side of a substrate () is provided. The substrate supporting apparatus () has a hollow shaft () and a rotary spindle (). The rotary spindle () is set in the hollow shaft () and a spacing is formed between an outer wall of the rotary spindle () and an inner wall of the hollow shaft (). The outer wall of the rotary spindle () defines a blocking wall () and a recess () to prevent particles in the spacing from entering a gas groove () which is formed on the hollow shaft () and supplies gas to a front side of the substrate (), avoiding the particles contaminating the front side of the substrate (), which improves the quality of semiconductor devices.

Substrate supporting apparatus

A substrate supporting apparatus includes a rotatable chuck, a first mass flow controller, a second mass flow controller, a plurality of locating pins and guiding pillars, and a motor in which the rotatable chuck defines a plurality of first injecting ports and second injecting ports, the first injecting ports are connected with a first gas passage for supplying gas to the substrate and sucking the substrate by Bernoulli effect, the second injecting ports are connected with a second gas passage for supplying gas to the substrate and lifting the substrate, the first and the second mass flow controllers are respectively installed on the first and the second gas passages, the plurality of locating pins and guiding pillars are disposed at the top surface of the rotatable chuck and every guiding pillar protrudes to form a holding portion, and the motor is used for rotating the rotatable chuck.

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Shanghai, China

Wenjun Wang