Taiwan Semiconductor Manufacturing Comp. Ltd.

Wen-Tsai Su

Ming-Cheng Hsu

Te-Kun Lin

Yu-Hsien Tsai

Chih-Chiang Chen

Ming-Jer Chiu

Wen-Feng Liao

Yuan-Pin Huang

Chin-Chi Shen

Pao-Kun Liao

A method for detecting a contact force of a probe card is provided. The method includes contacting a pressure film sensor with a plurality of needles over a lower surface of the probe card. The method includes detecting the contact force of the probe card via the pressure film sensor. The method also includes adjusting a position of a push base over an upper surface of the probe card based on the detected contact force of the pressure film sensor.

Method for detecting contact force of probe card

An apparatus is provided. The apparatus includes a stage and a plate disposed on the stage. The apparatus further includes a pressure film sensor that is formed on the plate and configured to detect a contact force between a plurality of needles on a probe head of a probe card and the pressure film sensor. The apparatus still includes a distance detector that is configured to detect a distance between the pressure film sensor and the needles. In addition, the apparatus includes an adjustment driver that is configured to adjust the probe card based on the detected contact force of the pressure film sensor.

Probe card, apparatus and method for detecting contact force of probe card

A probe head includes a first substrate, a second substrate, a spacer, at least one probe, and an insulating material. The first substrate has at least one first through hole. The second substrate has at least one second through hole. The spacer is disposed between the first substrate and the second substrate. The spacer, the first substrate, and the second substrate together form a cavity. The probe is disposed in the cavity and protrudes from the first through hole and the second through hole. The insulating material is on the probe and at least partially disposed in the first through hole.

Probe head, probe card assembly using the same, and manufacturing method thereof

Bond pad structures are presented. Some embodiments of the structure include a conductive conductor-insulator layer overlying a substrate. The conductive conductor-insulator layer includes a composite region having a conductor sub-region and insulator sub-region, which neighbor each other, and a single material region. The insulator is harder than the conductor.

Bond pad structure

A device for rapidly cooling a semiconductor wafer test/transfer machine and which includes a body which is provided with an interior gas passage one end of which is connected to a source of clean, dry air or other gas by a tubing. In typical application, the body is rested on the cover of a semiconductor wafer test or transfer machine, typically above or adjacent to the chuck or other wafer holder of the machine, with the other end of the gas passage in contact with the cover. The air or gas flowing through the gas passage impinges against the machine cover and rapidly cools the chuck or other wafer holder.

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Hsinchu, Taiwan

Wen-Tsai Su