Zhuhai Access Semiconductor Co., Ltd

Weiyuan Yang

Lei Feng

Benxia Huang

Xianming Chen

Yejie Hong

Wenshi Wang

Minxiong Li

A capacitor and inductor embedded structure and a manufacturing method therefor, and a substrate are disclosed. The method includes: providing a metal plate; sequentially depositing and etching a first protective layer, a thin film dielectric layer, a second protective layer, and an upper electrode layer on an upper surface of the metal plate to form a thin film capacitor and a capacitor upper electrode; pressing an upper dielectric layer to the upper surface of the metal plate, covering the thin film capacitor and the capacitor upper electrode, and etching the metal plate to form a capacitor lower electrode; pressing a lower dielectric layer to a lower surface of the metal plate, and performing drilling on the upper dielectric layer and the lower dielectric layer to form inductor through holes and capacitor electrode through holes; electroplating metal to form an inductor and circuit layers.

Capacitor and inductor embedded structure and manufacturing method therefor, and substrate

An embedded packaging method capable of realizing heat dissipation, includes: providing a frame having at least one through hole; attaching a tape on the first surface and placing a device in the through hole; completely filling the through hole with photosensitive insulating material, and completely curing the photosensitive insulating material in a lower portion of the through hole while not completely curing the photosensitive insulating material in an upper portion of the through hole and covered on the second surface; electroplating on the first surface to form a first metal layer, and electroplating on the upper surface and a side surface of the device, an upper surface of the photosensitive insulating material and an upper end face of each of the first copper pillars to form a second metal layer; and etching to obtain a first circuit layer and a second circuit layer, respectively.

Embedded packaging method capable of realizing heat dissipation

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Zhuhai, China

Weiyuan Yang