Cadence Design Systems, Inc.

Synopsys, Inc.

Weiping Fang

Junjiang Lei

Srini Doddi

Frank E Gennari

Ya-Chieh Lai

Srinivas Rao Doddi

Matthew W Moskewicz

Kuanghao Lay

Yuli Xue

Kuang-Hao Lay

Lawrence S Melvin, Iii

Hua Song

Chung-Shin Kang

Judy Huckabay

Erdem Cilingir

Daniel Zhang

Juhwan Kim

Marco Hug

Shiying Zhou

Zong Wu Tang

Jun Zhu

Zongwu Tang

Tong Gao

Srini Arikati

John R Studders

Yang-Shan Tong

Byungwook Kim

Yibing Wang

Paul David Friedberg

Chen Gao

Ke Fan

Srinivasa R Arikati

Tony Tan

Paul C Liu

Huijuan Zhang

Pattern matching using anchors during integrated circuit (IC) verification is disclosed. According to one embodiment, a method includes obtaining match time estimates associated with pattern anchors of different anchor types for an IC pattern, generating revised match time estimates based on a target IC layout, and then selecting the pattern anchor associated with the shortest revised match time estimate. Then, target anchors of the same anchor type as the selected pattern anchor are generated for the target IC layout, and the target IC layout is searched for the IC pattern using the selected pattern anchor and the target anchors.

Pattern matching using anchors during integrated circuit verification

A computer implemented method for validating a design is presented. The method includes generating, using the computer, a graph non-decomposable to a colored graph representative of the design, when the computer is invoked to validate the design. The method further includes identifying, using the computer, at least one guidance to at least one conflict in a mask layout associated with the design, the conflict causing the graph to be non-decomposable.

Detecting and displaying multi-patterning fix guidance

A computer-implemented method for validating a design characterized by a multi-patterning layer is presented. The method includes receiving the multi-patterning layer in a memory of the computer when the computer is invoked to validate the design. The method further includes correcting, using the computer, a first error in a first shape of the multi-patterning layer in accordance with a first rule thereby forming a corrected layer. The method further includes incrementally validating, using the computer, a first portion of the corrected layer in accordance with the first error and a first connected component of a first graph associated with the multi-patterning layer.

Incremental multi-patterning validation

A two-level matching technique is described. A system can generate a set of index patterns based on a set of library patterns in a pattern library. The pattern library can include patterns that are expected to have problems during manufacturing. Next, the system can use a fast matching process to check if a first-level pattern clip potentially matches one or more index patterns from the set of index patterns. If so, the system can use a detailed matching process to match a second-level pattern clip with library patterns that correspond to the one or more index patterns. Otherwise, the system can report that the first-level pattern clip does not match any library pattern in the pattern library.

Scalable pattern matching between a pattern clip and a pattern library

A method of performing double patterning (DPT) conflict repairs is described. In this method, even cycles adjacent to odd cycles in a layout can be identified (also called adjacent even/odd cycles herein). The identifying can include forming graph constructs of the layout. Route guidances for break-link operations and split-node operations can be prioritized for the adjacent even/odd cycles. A list including the route guidances for the break-link operations and the split-node operations can be generated. The list can be ordered based on the prioritizing.

Automated repair method and system for double patterning conflicts

A approach is described for allowing electronic design, verification, and optimization tools to implement very efficient approaches to allow the tools to directly address the effects of manufacturing processes, e.g., to identify and prevent problems caused by lithography processing. Fast models and pattern checking are employed to integrate lithography and manufacturing aware processes within EDA tools such as routers.

Method and system for model-based design and layout of an integrated circuit

A method, system, and computer program product for preprocessing a pattern in a library of patterns and querying a preprocessed library of patterns are disclosed. Embodiments for querying a preprocessed library of patterns are disclosed for determining a distance between the representation for the first pattern and the representation for the second pattern, determining whether the distance between the representation for the first pattern and the representation for the second pattern is within the range for the first pattern, and transforming the second pattern with the transformation matrix to provide information about the second pattern. Embodiments for preprocessing a pattern in a library of patterns are disclosed for determining a transformation matrix for the first pattern, determining a range for the first pattern, wherein a distance between a representation for a first pattern and a representation for a second pattern is within the range and the second pattern can be transformed with the transformation matrix to provide information about the second pattern, and associating the range and the transformation matrix with the first pattern.

Interpolation of irregular data in a finite-dimensional metric space in lithographic simulation

A method, system, and computer program product are disclosed for generating a pattern signature to represent a pattern in an integrated circuit design. In one approach, the method, system and computer program product transform pattern data, two dimensional data for the pattern, into a set of one dimensional mathematical functions, compress the set of one dimensional mathematical functions into a single variable function, compress the single variable function by calculating a set of values for the single variable function, and generate a pattern signature for the pattern from the set of values.

Pattern signature

The present invention is directed to an improved method, system, and computer program product for accessing and analyzing patterns in the integrated circuit design. The method, system or computer program product includes generating an intelligent signature for a pattern. The derived pattern signature is an intelligent pattern identifier because it retains only essential information about a pattern that corresponds to lithography printable portions of the pattern. Accordingly, one pattern signature can represent a group of design patterns that are equivalents from a lithography perspective.

Intelligent pattern signature based on lithography effects

Some embodiments provide a method and system for identifying error markers for patterns within a design layout that do not meet the manufacturing constraints. Some embodiments extend a region from the error marked region to extract a pattern for decomposition analysis. Some embodiments compare the extracted pattern to known patterns stored in a library, which also stores at least one previously computed decomposition solution for each known pattern. For an extracted pattern existing within the library, some embodiments retrieve the previously computed decomposition solution from the library. For an extracted pattern that does not exist within the library, some embodiments use one or more simulations to determine a decomposition solution for the extracted pattern. The resulting decomposition solution replaces the extracted pattern within the design layout producing a variant of the original layout that contains the decomposed solution for the pattern.

System and method for multi-exposure pattern decomposition

One embodiment provides a system for using a database to quickly identify a manufacturing problem area in a layout. During operation, the system receives a first check-figure which identifies a first area in a first layout, wherein the first area is associated with a first feature. Next, the system determines a first sample using the first check-figure, wherein the first sample represents the first layout's geometry within a first ambit of the first check-figure, wherein the first sample's geometry is expected to affect the shape of the first feature. The system then performs a model-based simulation using the first sample to obtain a first simulation-result which indicates whether the first feature is expected to have manufacturing problems. Next, the system stores the first simulation-result in a database which is used to quickly determine whether a second feature is expected to have manufacturing problems.

Method and apparatus for using a database to quickly identify and correct a manufacturing problem area in a layout

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Fremont, CA, United States of America

Weiping Fang