Faraday Technology Corporation

National Yang Ming Chiao Tung University

M31 Technology Corporation

Wei-Chiang Shih

Ching-Te Chuang

Wei Hwang

Chia-Cheng Chen

Hao-I Yang

Nan-Chun Lien

Shyh-Jye Jou

Yi-Wei Lin

Ming-Hsien Tu

Ming-Chien Tsai

Zhi-Xian Chou

Yu-Wei Yeh

Kuen-Di Lee

Mao-Chih Hsia

Li-Wei Chu

Chen-Hao Po

Chen-Wei Lin

Kwo-Jen Liu

Geng-Cing Lin

Chien-Yu Lu

Chih-Kang Chiu

Chao-Kuei Chung

Jihi-Yu Lin

Shao-Cheng Wang

Shyh-Chyi Yang

Yuh-Jiun Lin

Hsiao-Ping Lin

Yu-Chun Lin

Jyun-Kai Chu

Hung-Yu Lee

Kun-Di Lee

Yung-Wei Lin

An error correcting system is provided. The error correcting system includes an error correcting code (ECC) circuit and a control circuit. The ECC circuit is configured to encode input data received from M input terminals to generate encoded data in response to a write operation, and output the encoded data. The input data includes write data associated with the write operation, and the encoded data includes the input data and associated parity data. The control circuit is coupled to at least one of the M input terminals. When the write operation is directed to a memory device having a data bit width less than M bits, the write data is inputted to a portion of the M input terminals, the control circuit is configured to provide reference data to another portion of the M input terminals, and the write data and the reference data serve as the input data.

Error correcting system shared by multiple memory devices

A memory device includes: at least one memory cell; a bit line connected to the at least one memory cell; a write controller; a write driver receiving a logic signal from an output terminal of the write controller, and driving the bit line based on the logic signal; a negative voltage generator generating a reference voltage for receipt by a ground terminal of the write driver; and a protector connected to one of a power terminal and the output terminal of the write controller. The protector is capable of releasing stress voltage of the write driver.

Memory device capable of releasing stress voltage

A method for assisting a memory cell in an access operation is provided. The method includes: setting a supply voltage to a first supply voltage level to determine a reference probability value of the memory cell applied by the first supply voltage level; applying an assist voltage to an access line coupled to the memory cell, and setting the supply voltage to a second supply voltage level to determine a relationship between the assist voltage and the access failure probability of the memory cell applied by the second supply voltage level; determining, from the relationship, a target assist voltage level of the assist voltage corresponding to the reference probability value; and providing an assist circuit configured to apply the target assist voltage level to the access line during the access operation, wherein the memory cell is applied by the second supply voltage level during the access operation.

Method for assisting memory cell in access operation and operating memory cell, and memory device having assist circuit with predefined assist strength

A pulse width modulation device for use in an N-ports random access memory having a plurality of word line sets, wherein a specified word line set comprises N port word lines. The pulse width modulation device comprises a status detecting device and a clock signal generator. The status detecting device is coupled to the N port word lines having a first and a second port word line, and outputs a first control signal when both the voltage values of the first and second port word lines are within a first level range. The clock signal generator is coupled to the status detecting device and the specified word line set, and generates and outputs a first clock signal to the specified word line set, wherein a duration of the first clock signal kept within the first level range is variable in response to the first control signal.

Pulse width modulation device

A method of generating optimized memory instances using a memory compiler is disclosed. Data pertinent to describing a memory to be designed are provided, and front-end models and back-end models are made to supply a library. Design criteria are received via a user interface. Design of the memory is optimized among speed, power and area according to the provided library and the received design criteria, thereby generating memory instances.

Method of generating optimized memory instances using a memory compiler

The present invention provides an oscillator which is based on a 6T SRAM for measuring the Bias Temperature Instability. The oscillator includes a first control unit, a first inverter, a second control unit, and a second inverter. The first control unit is coupled with the first inverter. The second control unit is coupled with the second inverter. The first control unit and the second control unit is used to control the first inverter and the second inverter being selected, biased, and connected respectively, so that the NBTI and the PBTI of the SRAM can be measured separately, and the real time stability of the SRAM can be monitored immediately.

Oscillato based on a 6T SRAM for measuring the bias temperature instability

A SRAM that keeps the memory cell array under a low voltage in the Standby mode and Write mode, and raises the memory cell array supply voltage to a high voltage in the Read mode. A SRAM comprising: at least one memory cell circuit, comprising a latch circuit with at least two inverters, and comprising two power receiving terminals for receiving power; and a power supplying circuit, for providing the power to the memory cell circuit, such that the voltages at the power receiving terminals of the latch circuit is below a predetermined voltage level when data is written to the latch circuit. In one embodiment, the memory cell circuit includes a plurality of data accessing terminals and the data accessing terminals are respectively controlled by at least two pass-transistor switch devices.

Low power static random access memory

A threshold voltage measurement device is disclosed. The device is coupled to a 6T SRAM. The SRAM comprises two inverters each coupled to a FET. Power terminals of one inverter are in a floating state; the drain and source of the FET coupled to the inverter are short-circuited. Two voltage selectors, a resistor, an amplifier and the SRAM are connected in a negative feedback way. Different bias voltages are applied to the SRAM for measuring threshold voltages of two FETs of the other inverter and the FET coupled to the other inverter. The present invention uses a single circuit to measure the threshold voltages of the three FETs without changing the physical structure of the SRAM. Thereby is accelerated the measurement and decreased the cost of the fabrication process and measurement instruments.

Threshold voltage measurement device

A Random Access Memory (RAM) with a plurality of cells is provided. In an embodiment, the cells of a same column are coupled to a same pair of bit-lines and are associated to a same power controller. Each cell has two inverters; the power controller has two power-switches. For the cells of the same column, the two power-switches respectively perform independent supply voltage controls for the two inverters in each cell according to data-in voltages of the bit-lines during Write operation.

Data-aware dynamic supply random access memory

SRAM writing system and related apparatus are provided. The writing system of the invention has a dummy replica writing circuit, a negative pulse controller and at least a normal writing circuit; each normal writing circuit includes a write driver and a negative pulse supplier. While writing, the dummy replica writing circuit drives a dummy replica bit-line, such that the negative pulse controller generates a negative pulse control signal according to level of the dummy replica bit-line. In each writing circuit, when the write driver conducts to connect an associated bit-line to a bias end for driving a level transition, the negative pulse supplier switches the bias end from an operation voltage to a different negative pulse voltage according to the received negative pulse control signal.

SRAM writing system and related apparatus

A static random access memory with data controlled power supply, which comprises a memory cell circuit and at least one Write-assist circuit, for providing power to the memory cell circuit according to data to be written to the memory cell circuit.

Static random access memory with data controlled power supply

A Random Access Memory (RAM) is provided. The RAM includes a plurality of word-line drivers, at least a first tracking transistor and a second tracking transistor. Each word-line driver has an input node receiving a decoding signal, a power node receiving an operation voltage and a driving node driving a word-line. In an embodiment, the first tracking transistor has two channel terminal nodes respectively coupled to the driving node of one of the word-line driver and a channel terminal node of the second tracking transistor; wherein the first tracking transistor has electronic characteristics tracking those of a driving transistor of word-line driver, and the second tracking transistor has electronic characteristics tracking those of pass-gate transistor(s) in each cell of the RAM.

Variation-tolerant word-line under-drive scheme for random access memory

A SRAM cell structure includes a first N type switch, a second N type switch, a first storage node, and a second storage node. The first N type switch has a control terminal connected to a word line and a first terminal connected to a bit line. The second N type switch has a control terminal connected to the word line and a first terminal connected to an inverted bit line. The first storage node has a first terminal connected to a second terminal of the first N type switch. The second storage node has a first terminal connected to a second terminal of the second N type switch.

2T SRAM cell structure

A combo memory cell having a SRAM cell and a mask-ROM code programmer. The SRAM cell comprises first and second inverters. The first inverter comprises a first PMOS transistor and a first NMOS transistor. Gates of the first PMOS and NMOS transistors are commonly connected to a first input node and drains thereof commonly connected to a first output node. The second inverter comprises a second PMOS transistor and a second NMOS transistor. Gates of the second PMOS and NMOS transistors are commonly connected to a second input node and drains thereof commonly connected to a second output node. The first input node and the second output node are connected, as are the second input node and the first output node. The mask-ROM code programmer is coupled to the sources of the first and second PMOS transistors or the first and second NMOS transistors.

Growing community of inventors

Taipei, Taiwan

Wei-Chiang Shih