Semiconductor Manufacturing International (Shanghai) Corporation

Semiconductor Manufacturing International Corp.

Semiconductor Manufacturing International (Beijing) Corporation

Wayne Bao

Haibo Xiao

Yanlei Ping

Semiconductor devices and fabrication methods for simultaneously forming a 3T-FinFET and a 4T-FinFET on a same substrate are provided. A first fin and a second fin can be formed on a semiconductor substrate. The first fin has a top surface higher than the second fin. A first gate dielectric layer and a first gate can be formed across the first fin. A second gate dielectric layer and a second gate can be formed across the second fin. An interlayer dielectric layer can be formed to cover the first gate, the second gate, and the semiconductor substrate. A first portion of the interlayer dielectric layer, a portion of the first gate, and a portion of the first gate dielectric layer, over the first fin, and a second portion of the interlayer dielectric layer over the second fin can be removed to expose the second gate.

Semiconductor device with three or four-terminal-FinFET

A semiconductor device includes a substrate that has a surface. The semiconductor further includes a fin disposed on the surface and including a semiconductor member. The semiconductor further includes a spacer disposed on the surface, having a type of stress, and overlapping the semiconductor member in a direction parallel to the surface. A thickness of the spacer in a direction perpendicular to the surface is less than a height of the semiconductor member in the direction perpendicular to the surface.

Semiconductor device and manufacturing method thereof

This application discloses a Fin FET structure and a method for forming the same. In the Fin FET structure, there are lower stress spacers disposed over the lower portion of the fin's opposite sidewalls, asserting one stress type to suppress the carrier mobility; there are also upper stress spacers disposed over the upper portion of the fin's opposite sidewalls, asserting an opposite stress type to increase the carrier mobility. Therefore, the leakage current in the fin FET is reduced and the device performance is improved. In the method, the stress spacers are formed by depositing stress layers and etching back the stress layers, where stress types and magnitudes are controllable, resulting in a simple process.

Method for forming fin FET structure with dual-stress spacers

Fabrication method for semiconductor device with three or four-terminal-FinFET

Fin FET structure with dual-stress spacers and method for forming the same

Exemplary embodiments provide materials and methods for forming a metal silicide layer and/or an NMOS transistor. The metal silicide layer can be formed by heating a metal layer containing at least a tellurium element on a semiconductor substrate. The metal silicide layer can thus contain at least the tellurium element on the semiconductor substrate. The metal silicide layer can be formed in an NMOS transistor. With the addition of tellurium element in the metal silicide layer, Schottky barrier height between the metal silicide layer and the underling semiconductor substrate can be reduced. Contact resistance of the NMOS transistor can also be reduced.

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Shanghai, China

Wayne Bao