Kabushiki Kaisha Toshiba

Wataru Igarashi

Yasuo Naruke

A semiconductor device comprises: a semiconductor substrate; a field oxide film formed in the semiconductor substrate, the field oxide film having element forming regions on both sides thereof; a pair of MOS transistors formed in the element forming regions on both sides of the field oxide film, each of the transistors having a gate oxide film, a gate electrode and a pair of source/drain regions; an interlayer insulating film covering the semiconductor substrate, the field oxide film and the transistors; a local interconnect formed by embedding a conductive material in a first opening formed in the interlayer insulating film, the first opening being arranged above the field oxide film and having a greater width than the field oxide film, an inner one of the pair of source/drain regions of each of the pair of transistors being exposed to the first opening, the inner one of the pair of source/drain regions of one of the pair of transistors being electrically connected to the inner one of the pair of source/drain regions of the other of the pair of transistors by means of the local interconnect; and a pair of buried contacts formed by embedding a pair of conductive materials in a pair of second openings formed in the interlayer insulating film, the pair of second openings being arranged above an outer one of the pair of source/drain regions of each of the pair of transistors, the outer one of the pair of source/drain regions being exposed to the second openings.

Growing community of inventors

Yokohama, Japan

Wataru Igarashi