Tokyo Electron Limited

Walter Swanson

Kenichi Miyamoto

Minoru Kubota

Hideya Tanaka

A substrate washing apparatus, comprising a spin chuck for holding and rotating a substrate W, a brushing section including a scrubbing member which is brought into contact with a washing surface of the substrate held on the spin chuck and revolved on its own axis together with rotation of the spin chuck, a washing liquid supply mechanism for supplying a washing liquid through the brushing section onto the washing surface of the substrate, a pressure control mechanism for controlling a pressing force of the scrubbing member against the washing surface of the substrate, and a moving means for moving the scrubbing member relative to the substrate in a radial direction of the substrate, wherein the scrubbing member includes an abutting portion which is brought into contact with the washing surface of the substrate, and a non-contact peripheral portion positioned about the abutting portion and formed not to contact the washing surface of the substrate when the abutting portion is in contact with the washing surface of the substrate.

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Kikuyo-Machi, Japan

Walter Swanson