Samsung Electronics Co., Ltd.

Adeka Corporation

Wakana Fuse

Younjoung Cho

Takanori Koide

Yutaro Aoki

Seungmin Ryu

Gyuhee Park

Hiroyuki Uchiuzou

Kazuya Saito

Yoshiki Manabe

Soyoung Lee

Akio Saito

Younsoo Kim

Jaesoon Lim

Jaewoon Kim

Kazuki Harano

An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),

Organometallic compound and method of manufacturing integrated circuit using the same

An organometallic adduct compound and a method of manufacturing an integrated circuit (IC) device, the organometallic adduct compound being represented by General formula (I):

Organometallic adduct compound and method of manufacturing integrated circuit using the same

A niobium compound and a method of forming a thin film using the niobium compound, the compound being represented by the following General formula I: 

Niobium compound and method of forming thin film

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Wakana Fuse