Applied Materials, Inc.

University of California

Waheb Bishara

Samer Banna

Aydogan Ozcan

Takemasa Miyagi

Valentin Nikolov Todorow

Dermot Cantwell

Vladimir Knyazik

Kyle Tantiwong

Dmitry Lubomirsky

Mehdi Vaez-Iravani

Alvaro Garcia De Gorordo

Dong Wu

Lior Engel

Bin Lin

Serhan Omer Isikman

Xinhuo Xiao

Ryan Giar

Stephanie W Chen

Display panel portion with graphical user interface

One or more images of a device feature are acquired using an imaging tool. A geometrical shape is defined encompassing the relevant pixels of each image, where the geometrical shape is represented in terms of one or more parameters. A cost function is defined whose variables comprise the one or more parameters of the geometrical shape. For each image, numerical optimization is applied to obtain optimal values of the one or more parameters for which the cost function is minimized. The optimal values of the one or more parameters are reported as metrology data pertaining to the device feature.

Optimization-based image processing for metrology

This disclosure describes methods and systems for building a spatial model to predict performance of processing chamber, and using the spatial model to converge faster to a desired process during the process development phase. Specifically, a machine-learning engine obtains an empirical process model for a given process for a given processing chamber. The empirical process model is calibrated by using the in-line metrology data as reference. A predictive model is built by refining the empirical process model by a machine-learning engine that receives customized metrology data and outputs one or more spatial maps of the wafer for one or more dimensions of interest across the wafer without physically processing any further wafers, i.e. by performing spatial digital design of experiment (Spatial DoE).

Predictive spatial digital design of experiment for advanced semiconductor process optimization and control

This disclosure describes methods and systems for building a spatial model to predict performance of processing chamber, and using the spatial model to converge faster to a desired process during the process development phase. Specifically, the method obtains virtual metrology (VM) data from sensors of the chamber and on-board metrology (OBM) data from devices on the wafers; obtains in-line metrology data from precision scanning electron microscope (SEM); and also obtains an empirical process model for a given process. The empirical process model is calibrated by using the in-line metrology data as reference. A predictive model is built by refining the empirical process model by a machine-learning engine that receives customized metrology data and outputs one or more spatial maps of the wafer for one or more dimensions of interest across the wafer without physically processing any further wafers, i.e. by performing spatial digital design of experiment (Spatial DoE).

A method for flexible inspection of a sample includes forming an input beam using a beam source, blocking a portion of the input beam using an input mask, and forming a shaped beam from a portion of the input beam. The shaped beam is received at a first portion of an objective lens and focused onto a sample. A reflected beam is collected at a second portion of the objective lens. Scattered light is collected at the first and second portions of the objective lens and at a third portion of the objective lens. The scattered light is received at a dark-field detector module and a portion of the scattered light is directed to a dark-field detector. The dark-field detector module includes an output mask having one or more output apertures that allow at least part of the scattered light that passes through the third portion of the object lens to pass as the portion of the scattered light that is directed to the dark-field detector.

Flexible mode scanning optical microscopy and inspection system

A plasma processing apparatus may include a process chamber having an interior processing volume, first, second and third RF coils disposed proximate the process chamber to couple RF energy into the processing volume, wherein the second RF coil disposed coaxially with respect to the first RF coil, and wherein the third RF coil disposed coaxially with respect to the first and second RF coils, at least one ferrite shield disposed proximate to at least one of the first, second or third RF coils, wherein the ferrite shield is configured to locally guide a magnetic field produced by an RF current flow through the first, second or third RF coils toward the process chamber, wherein the plasma processing apparatus is configured to control a phase of each RF current flow through each of the of the first, second or third RF coils.

High efficiency triple-coil inductively coupled plasma source with phase control

Apparatus for processing substrates are provided herein. In some embodiments, plasma processing apparatus may include a process chamber having a dielectric lid and an interior processing volume beneath the dielectric lid, a first RF coil to couple RF energy into the processing volume, and an RF shielded lid heater coupled to a top surface of the dielectric lid. The RF shielded lid heater may include an annular member, and a plurality of spokes, wherein each of the plurality of spokes includes one of (a) a first portion that extends downward from the annular and couples the annular member to a second portion of the spoke that extends radially inward, or (b) a first portion that extends radially outward from the annular member.

High efficiency inductively coupled plasma source with customized RF shield for plasma profile control

A method and system of imaging a moving object within a microfluidic environment includes illuminating a first side of a flow cell configured to carry the moving object within a flow of carrier fluid with an illumination source emitting at least partially coherent light, the at least partially coherent light passing through an aperture prior to illuminating the flow cell. A plurality of lower resolution frame images of the moving object are acquired with an image sensor disposed on an opposing side of the flow cell, wherein the image sensor is angled relative to a direction of flow of the moving object within the carrier fluid. A higher resolution image is reconstructed of the moving object based at least in part on the plurality of lower resolution frame images.

Method and device for holographic opto-fluidic microscopy

A lens-free system for the three-dimensional imaging of objects contained within a sample places a sample holder between an image sensor and an illumination source, with the sample-sensor distance being much smaller than the sample-illumination source distance. Holographic images are taken at different angles as well as different lateral jogs within a single angle and are reconstructed into a three dimensional image of objects within the sample. The system may be a hand held, portable unit.

Lens-free tomographic imaging devices and methods

An apparatus for providing processing gases to a process chamber with improved uniformity is disclosed. One embodiment provides a gas delivery assembly. The gas delivery assembly includes a hub, a nozzle, and one or more gas diffusers disposed in the nozzle. The nozzle has a cylindrical body with a side wall and a top surface. A plurality of injection passages are formed inside the nozzle to deliver processing gases into the process chamber via a plurality of outlets disposed in the side wall. The injection passages are configured to direct process gases out of each outlet disposed in the side wall in a direction which is not radially aligned with a centerline of the hub.

Tunable gas delivery assembly with internal diffuser and angular injection

Methods and apparatus for plasma-enhanced substrate processing are provided herein. In some embodiments, a method is provided for processing a substrate in a process chamber having a plurality of electromagnets disposed about the process chamber to form a magnetic field within the process chamber at least at a substrate level. In some embodiments, the method includes determining a first direction of an external magnetic field present within the process chamber while providing no current to the plurality of electromagnets; providing a range of currents to the plurality of electromagnets to create a magnetic field within the process chamber having a second direction opposing the first direction; determining a desired magnitude in the second direction of the magnetic field over the range of currents; and processing a substrate in the process chamber using a plasma while statically providing the magnetic field at the desired magnitude.

Methods for reducing etch nonuniformity in the presence of a weak magnetic field in an inductively coupled plasma reactor

A system for imaging objects within a sample includes an image sensor and a sample holder configured to hold the sample, the sample holder disposed adjacent to the image sensor. The system further includes an illumination source configured to scan in two or three dimensions relative to the sensor array and illuminate the sample at a plurality of different locations. The illumination source may include, by way of example, LEDs, laser diodes, or even a screen or display from a portable electronic device. The system includes least one processor configured to reconstruct an image of the sample based on the images obtained from illumination source at the plurality of different scan positions.

Growing community of inventors

Menlo Park, CA, United States of America

Waheb Bishara