Kla Corporation

Vladimir Tumakov

Bjorn Brauer

Richard Wallingford

Hucheng Lee

Sangbong Park

Xiaochun Li

James A Smith

Erfan Soltanmohammadi

Nurmohammed Patwary

Boshi Huang

A care area is determined in an image of a semiconductor wafer. The care area is divided into sub-care areas based on the shapes of polygons in a design file associated with the care area. A noise scan of a histogram for the sub-care areas is then performed. The sub-care areas are clustered into groups based on the noise scan of the histogram.

Clustering sub-care areas based on noise characteristics

A sample characterization system is disclosed. In embodiments, the sample characterization system includes a controller communicatively coupled to an inspection sub-system, the controller including one or more processors configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to: acquire one or more target image frames of a sample; generate a target tensor with the one or more acquired target image frames; perform a first set of one or more decomposition processes on the target tensor to generate one or more reference tensors including one or more reference image frames; identify one or more differences between the one or more target image frames and the one or more reference image frames; and determine one or more characteristics of the sample based on the one or more identified differences.

System and method for inspection using tensor decomposition and singular value decomposition

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Milpitas, CA, United States of America

Vladimir Tumakov