Applied Materials, Inc.

Veera Raghava Reddy Kakireddy

Rajeev Bajaj

Jason Garcheung Fung

Daniel Redfield

Gregory E Menk

Ashwin Chockalingam

Mayu Felicia Yamamura

Aniruddh Jagdish Khanna

Fred Conrad Redeker

Nag B Patibandla

Boyi Fu

Mahendra Christopher Orilall

Hou Tee Ng

Ashavani Kumar

Robert E Davenport

Mario Dagio Cornejo

Venkat Hariharan

Amritanshu Sinha

Puneet Narendra Jawali

Nandan Baradanahalli Kenchappa

Robert D Tolles

Jay Gurusamy

You Wang

Ekaterina A Mikhaylichenko

Huyen Karen Tran

Adam Wade Manzonie

Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage

Eric Davey

Joonho An

Jaeseok Kim

Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.

Polishing pads with interconnected pores

Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.

Structures formed using an additive manufacturing process for regenerating surface texture in situ

Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.

Polishing pads having selectively arranged porosity

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Polishing pads produced by an additive manufacturing process

A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or 'micro-features' and/or a plurality of grooves or 'macro-features' formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.

Thin plastic polishing article for CMP applications

Growing community of inventors

Santa Clara, CA, United States of America

Veera Raghava Reddy Kakireddy