Freescale Semiconductor,inc.

Veer Dhandapani

Bich-Yen Nguyen

Da Zhang

Mariam G Sadaka

Voon-Yew Thean

Gregory S Spencer

Peter J Beckage

Brian J Goolsby

Yasuhito Shiho

A semiconductor process and apparatus provide a planarized hybrid substrate () having a more uniform polish surface () by thickening an SOI semiconductor layer () in relation to a previously or subsequently formed epitaxial silicon layer () with a selective silicon deposition process that covers the SOI semiconductor layer () with a crystalline semiconductor layer (). By forming first gate electrodes () over a first SOI substrate () using deposited (100) silicon and forming second gate electrodes () over an epitaxially grown (110) silicon substrate (), a high performance CMOS device is obtained which includes high-k metal PMOS gate electrodes () having improved hole mobility.

Selective silicon deposition for planarized dual surface orientation integration

A semiconductor device with strain enhancement is formed by providing a semiconductor substrate and an overlying control electrode having a sidewall. An insulating layer is formed adjacent the sidewall of the control electrode. The semiconductor substrate and the control electrode are implanted to form first and second doped current electrode regions, a portion of each of the first and second doped current electrode regions being driven to underlie both the insulating layer and the control electrode in a channel region of the semiconductor device. The first and second doped current electrode regions are removed from the semiconductor substrate except for underneath the control electrode and the insulating layer to respectively form first and second trenches. An insitu doped material containing a different lattice constant relative to the semiconductor substrate is formed within the first and second trenches to function as first and second current electrodes of the semiconductor device.

Method for making a semiconductor device with strain enhancement

A method for making a semiconductor device is provided herein. In accordance with the method, a semiconductor structure is provided which comprises a substrate () with a gate structure () disposed thereon, wherein the gate structure comprises a gate electrode () and at least one spacer structure (), and wherein the substrate comprises a first semiconductor material. A first trench () is created in the substrate adjacent to the gate structure through the use of a first etch. The gate electrode is then etched with a second etch. Preferably, the minimum cumulative reduction in thickness of the gate electrode from the first and second etches is d, the maximum depth of the first and second trenches after the first and second etches is d, and d&#x2267;d.

Method for forming uniaxially strained devices

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Round Rock, TX, United States of America

Veer Dhandapani