Applied Materials Israel Limited

Applied Materials, Inc.

Vadim Kuchik

Nicolas L Breil

Dror Shemesh

Lior Akerman

A method for determining a depth of a hidden structural element of an object, the method may include (i) obtaining contrast information regarding a contrast between (a) hidden structural element detection signals that are indicative of electrons emitted from the hidden structural element, and (b) surroundings detection signals that are indicative of electrons emitted from a surroundings of the hidden structural element; wherein the hidden structural element detection signals and the surroundings detection signals are detected as a result of a scanning of a region of the object, with an illuminating electron beam; wherein the region comprises the hidden structural element and the surroundings; and (ii) determining the depth of the hidden structural element based, at least in part, on the contrast information.

Determining a depth of a hidden structural element background

A method for detecting voids in a metal line of a semiconductor device die includes: scanning an electron beam upon a selected location on the die containing the metal line; determine gray levels in an image produced by collected electrons of the electron beam backscattered from the selected location on the die; and identifying one or more voids in the metal line based on differences between the gray levels in the image.

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Kiriat Ekron, Israel

Vadim Kuchik