Corning Incorporated

Sandia National Laboratories

Uta-Barbara Goers

Philip Robert LeBlanc

Rajeshkannan Palanisamy

Correy Robert Ustanik

Tammy Lynn Petriwsky

En Hong

Samuel Odei Owusu

Robert Wendell Sharps

Robert Carl Burket

Sung-chan Hwang

Tae-ho Keem

Ji Hwa Jung

Sung-jong Pyo

Rostislav Vatchev Roussev

Chong Pyung An

Michal Mlejnek

Johannes Moll

Dahv A V Kliner

Thomas Jan Kulp

Robertson Dewhurst Booth

Karla M Armstrong

Ricky Sommers

Hyeong-cheol Lee

Amanda Kathryn Thomas

A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.

Method and system for measuring geometric parameters of through holes

A method of inspecting defects on a transparent substrate may include: selecting a gradient of an illumination optical system so that light incident on the transparent substrate has a first angle; selecting a gradient of a detection optical system so that an optical axis of the detection optical system located over the transparent substrate has a second angle, which is equal to or less than the first angle; adjusting a position of at least one of the illumination optical system, the transparent substrate, and the detection optical system so that a field-of-view of the detection optical system covers a first region where the light meets a first surface of the transparent substrate and does not cover a second region where light meets a second surface of the transparent substrate, the second surface being opposite to the first surface; illuminating the transparent substrate; and detecting light scattered from the transparent substrate.

Method and apparatus for inspecting defects on transparent substrate and method emitting incident light

A method of inspecting defects of a transparent substrate may include: illuminating a transparent substrate; calculating an incidence angle range of light so that a first region where the light meets a first surface of the transparent substrate and a second region where light meets a second surface being opposite the first surface of the transparent substrate do not overlap each other; adjusting an incidence angle according to the incidence angle range; adjusting a position of a first detector so that a first field-of-view of the first detector covers the first region and does not cover the second region; adjusting a position of a second detector so that a second field-of-view of the second detector covers the second region and does not cover the first region; and obtaining a first image of the first region and a second image of the second region from the first and second detector, respectively.

Method and apparatus for inspecting defects on transparent substrate

Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.

Work pieces and methods of laser drilling through holes in substrates using an exit sacrificial cover layer

Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Methods for forming vias in glass substrates

A method for operating a frequency converted laser source comprising at least one semiconductor laser and a wavelength conversion device optically coupled to at least one semiconductor laser may include operating the frequency converted laser source to produce a frequency converted output beam from the wavelength conversion device and intermittently heating the wavelength conversion device above a recovery threshold temperature Tof the wavelength conversion device. When the wavelength conversion device is heated above the recovery threshold temperature, the wavelength conversion device is held above the recovery threshold temperature Tfor a period of time sufficient to restore output power lost to photo-degradation in the wavelength conversion device during operation of the frequency converted laser source.

Frequency converted laser sources and methods for operating frequency converted laser sources

A multi-camera skin inspection system for inspecting the outer skin and the skin perimeter of extruded ceramic honeycomb structures is disclosed. The system has a camera that captures first digital line images of a line-illuminated portion of the outer skin as the ceramic honeycomb structure rotates to form a scanned digital image of the outer skin. The system also has second and third cameras that respectively capture second and third digital line images of illuminated first and second endfaces, including the corresponding first and second skin perimeters, as the ceramic honeycomb structure rotates to form scanned digital images of the ceramic honeycomb structure perimeters. The system also forms a composite image from the three scanned images and identifies at least one defect in the ceramic honeycomb structure from the composite image.

Multi-camera skin inspection system for extruded ceramic honeycomb structures

A method of controlling an optical package is provided where the average power density of the output beam of the semiconductor laser on the input facet of the wavelength conversion device in a relatively high power wavelength conversion mode exceeds the power density of the output beam of the semiconductor laser on the input facet of the wavelength conversion device in a relatively low power contaminant removal mode. In the relatively high power wavelength conversion mode, the adjustable optical components are utilized to correlate an optimum intensity value of a wavelength-converted output of the wavelength conversion device with optimum coordinates representing the position of the output beam of the semiconductor laser on the waveguide portion of the input facet of the wavelength conversion device. In the relatively low power contaminant removal mode, the adjustable optical components are utilized to scan the output beam of the semiconductor laser across the waveguide portion of the input facet of the wavelength conversion device while maintaining the power density of the output beam on the input facet of the wavelength conversion device below the average power density of the output beam in the relatively high power wavelength conversion mode. Additional embodiments are disclosed and claimed.

In-situ contaminant removal in optical packages

The location of gases that are not visible to the unaided human eye can be determined using tuned light sources that spectroscopically probe the gases and cameras that can provide images corresponding to the absorption of the gases. The present invention is a light source for a backscatter absorption gas imaging (BAGI) system, and a light source incorporating the light source, that can be used to remotely detect and produce images of 'invisible' gases. The inventive light source has a light producing element, an optical amplifier, and an optical parametric oscillator to generate wavelength tunable light in the IR. By using a multi-mode light source and an amplifier that operates using 915 nm pump sources, the power consumption of the light source is reduced to a level that can be operated by batteries for long periods of time. In addition, the light source is tunable over the absorption bands of many hydrocarbons, making it useful for detecting hazardous gases.

Growing community of inventors

Campbell, NY, United States of America

Uta-Barbara Goers