Micron Technology Incorporated

Intel Corporation

Ugo Russo

Andrea Redaelli

Kishore Kumar Muchherla

Chris M Carlson

Niccolo' Righetti

Fabio Pellizzer

Violante Moschiano

Akira Goda

Nicola Ciocchini

Jonathan Scott Parry

Agostino Pirovano

Giorgio Servalli

Simone Lavizzari

Sivagnanam Parthasarathy

Vamsi Pavan Rayaprolu

Mustafa Nazmi Kaynak

Mark Alan Helm

James Fitzpatrick

Giuseppe Cariello

Jung Sheng Hoei

Eric N Lee

Zhenlei Shen

Murong Lang

Steven Michael Kientz

Max F Hineman

Jeffrey S McNeil, Jr

Mauro Luigi Sali

Zhongguang Xu

Andrea D'Alessandro

Lawrence Celso Miranda

Charles See Yeung Kwong

Sheyang Ning

William C Filipiak

Silvia Beltrami

Niccolo′ Righetti

Lequn Jennifer Liu

Animesh Roy Chowdhury

Tong Liu

Stefano Falduti

Cobie B Loper

Shyam Sunder Raghunathan

Karan Banerjee

A vertical structure extends through a tiered structure of alternating conductive and insulative materials. The vertical structure includes a channel structure and a tunneling structure. At least one of the conductive materials of the tiered structure provides a select gate tier (e.g., including a control gate for a select gate drain (SGD) transistor). Adjacent the select gate tier of the tiered structure, the tunneling structure consists of or consists essentially of an oxide-only material. Adjacent the word line tiers of the tiered structure, the tunneling structure comprises at least one material that is other than an oxide-only material, such as a nitride or oxynitride. The oxide-only material adjacent the select gate tier may inhibit unintentional loss of charge from a neighboring charge storage structure, which may improve the stability of the threshold voltage (Vth) of the select gate tier.

Microelectronic devices with tunneling structures having partial-height high-κ material regions

A memory device comprises an array of memory cells organized into a plurality of wordlines, and a processing device to perform processing operations that receive a program command specifying a memory unit and data comprising first received data, where the plurality of wordlines includes one or more first active data wordlines and a group of consecutive retired wordlines. The processing operations also program the specified data to the memory unit by programming the first received data to the one or more first active data wordlines, identifying a first retired boundary wordline that is in the group of consecutive retired wordlines and is adjacent to one of the first active data wordlines, generating a first data pattern comprising a first plurality of threshold voltage levels, and programming the first data pattern to the first retired boundary wordline.

Selectively programming retired wordlines of a memory device

A system includes a memory device including multiple memory cells and a processing device operatively coupled to the memory device. The processing device is to receive a first read command at a first time. The processing device is further to receive a second read command at a second time. The processing device is further to determine that the first read command and the second read command are directed to an at least partially same set of memory cells of the plurality of memory cells. The processing device is further to perform a media management operation with respect to the at least partially same set of memory cells.

Modified read counter incrementing scheme in a memory sub-system

Some embodiments include an assembly having a stack of alternating dielectric levels and conductive levels. Channel material pillars extend through the stack. Some of the channel material pillars are associated with a first sub-block, and others of the channel material pillars are associated with a second sub-block. Memory cells are along the channel material pillars. An insulative level is over the stack. A select gate configuration is over the insulative level. The select gate configuration includes a first conductive gate structure associated with the first sub-block, and includes a second conductive gate structure associated with the second sub-block. The first and second conductive gate structures are laterally spaced from one another by an intervening insulative region. The first and second conductive gate structures have vertically-spaced conductive regions, and have vertically-extending conductive structures which electrically couple the vertically-spaced conductive regions to one another. Some embodiments include methods of forming assemblies.

Assemblies comprising memory cells and select gates; and methods of forming assemblies

One or more trim values associated with a set of blocks of a memory device are set according to a representative number of program erase cycles (PECs) for the set of blocks. Each block in the set of blocks was programmed within at least one of a specified time window or a specified temperature range. Responsive to executing a program operation on a block of the set of blocks according to the one or more trim values, an indicator is set to reflect the one or more trim values used during the execution of the program operation. Responsive to receiving a request to perform a read operation directed to the block of the set of blocks, a read offset value corresponding to the indicator is determined. The read operation is performed using the read offset value.

Charge loss mitigation throughout memory device lifecycle by proactive window shift

A method includes determining, by a processing device, a value of a memory endurance state metric associated with a segment of a memory device in a memory sub-system; determining a target value of a code rate based on the value of the memory endurance state metric, and adjusting the code rate of the memory device according to the target value, wherein the code rate reflects a ratio of a number of memory units designated for storing host-originated data to a total number of memory units designated for storing the host-originated data and error correction metadata.

Adjustment of code rate as function of memory endurance state metric

A processing device in a memory sub-system initiates a partial block handling protocol for a closed block of a memory device, the block comprising a plurality of wordlines. The processing device further sends a first programming command to the memory device to program one or more wordlines of the block with first padding data having a first data pattern, wherein the one or more wordlines are adjacent to a last wordline of the block programmed before the block was closed. In addition, the processing device sends a second programming command to the memory device to program all of a set of remaining wordlines of the block with second padding data having a second data pattern comprising fewer bits of data per cell than the first data pattern.

Partial block handling in a non-volatile memory device

A memory system may implement a read operation including a delay if a channel is at stable state, and may implement a read operation without a delay if the channel is in a transient state. Upon receiving a read command to a set of memory cells sharing the channel, the memory system may determine whether the channel is in a stable or transient state. If the channel is in a stable state, the memory system may perform a read operation including a delay between boosting the channel and driving respective word lines, such that the channel partially discharges prior to driving the word lines. If the channel is in a transient state, the memory system may perform a read operation without a delay between boosting the channel and driving the word lines.

Transient and stable state read operations of a memory device

Control logic in a memory device causes a first pulse to be applied to a plurality of word lines coupled to respective memory cells in a memory array during an erase operation. The control logic further causes a second pulse to be applied to a first set of word lines of the plurality of word lines to bias the first set of word lines to a first voltage. The control logic can cause a third pulse to be applied to a second set of word lines of the plurality of word lines to bias the second set of word lines to a second voltage and cause a fourth pulse to be applied to a source line of the memory array to erase the respective memory cells coupled to the first set of word lines and to program the respective memory cells coupled to the second set of word lines.

Programming selective word lines during an erase operation in a memory device

An average number of program erase cycles (PECs) for a memory device is identified. A set of trims associated with the average number of PECs is identified. One or more write trims associated with the memory device are set according to the set of trims. A write command directed to the memory device is received. The write command is executed according to the one or more write trims.

Microelectronic and semiconductor devices with a tunneling structure free of high-γ material by a select gate structure, and related methods

A system includes a memory device including multiple memory cells and a processing device operatively coupled to the memory device. The processing device is to receive a first read command at a first time. The first read command is with respect to a set of memory cells of the memory device. The processing device is further to receive a second read command at a second time. The second read command is with respect to the set of memory cells of the memory device. The processing device is further to increment a read counter for the memory device by a value reflecting a difference between the first time and the second time. The processing device is further to determine that a value of the read counter satisfies a threshold criterion. The processing device is further to perform a data integrity scan with respect to the set of memory cells.

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Boise, ID, United States of America

Ugo Russo