Spansion Llc.

Advanced Micro Devices Corporation

Intel Ndtm US LLC

Tzu-Ning Fang

Colin Stewart Bill

Swaroop Kaza

Sameer S Haddad

Steven C Avanzino

Michael A VanBuskirk

Christie Marrian

Zhida Lan

Wai Lo

Michael Allen Van Buskirk

Dongxiang Liao

Eugen Gershon

An Chen

David Gaun

Wei Daisy Cai

Matthew S Buynoski

Suzette Keefe Pangrle

Nicholas H Tripsas

Shantanu R Rajwade

Stuart Spitzer

Michael Vanbuskirk

Rezaul Haque

Yi-Ching Jean Wu

Narayanan Ramanan

Matin Amani

Netra Mahuli

Ahsanur Rahman

Bayan Nasri

Dhanashree R Kulkarni

John S Ennals

Jean Wu

Dong-Xiang Liao

Seong Je Park

A sense circuit performs a multistage boost, including a boost during precharge operation and a boost during the standard boost operation. The sense circuit includes an output transistor to drive a sense output based on current through a sense node which drives a gate of the output transistor. The sense circuit includes a precharge circuit to precharge the sense node and the gate of the output transistor and a boost circuit to boost the sense node. The boost circuit can be boosted during precharge by a first boost voltage, resulting in a lower boost applied to the sense node after precharge. The boost circuit boosts up the sense node by a second boost voltage lower than the first boost voltage. The boost circuit boosts the sense node down by the full boost voltage of the first boost voltage plus the second boost voltage after sensing.

Memory cell sensing circuit with adjusted bias from pre-boost operation

In a method of fabricating a metal-insulator-metal (MIM) device, initially, a first electrode is provided. An oxide layer is provided on the first electrode, and a protective layer is provided on the oxide layer. An opening through the protective layer is provided to expose a portion of the oxide layer, and a portion of the first electrode underlying the exposed portion of the oxide layer is oxidized. A second electrode is provided in contact with the exposed portion of the oxide layer. In alternative embodiments, the initially provided oxide layer may be eliminated, and spacers of insulating material may be provided in the opening.

Metal-insualtor-metal (MIM) device and method of formation thereof

Metal-insulator-metal (MIM) device and method of formation thereof

A write-once read-many times memory device is made up of first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrode. The memory device is programmed by providing a charged species from the passive layer into the active layer. The memory device may be programmed to have for the programmed memory device a first erase activation energy. The present method provides for the programmed memory device a second erase activation energy greater than the first erase activation energy.

Method of providing an erase activation energy of a memory device

A memory architecture that employs one or more semiconductor PIN diodes is provided. The memory employs a substrate that includes a buried bit/word line and a PIN diode. The PIN diode includes a non-intrinsic semiconductor region, a portion of the bit/word line, and an intrinsic semiconductor region positioned between the non-intrinsic region and the portion of the bit/word line.

Pin diode device and architecture

The present method provides annealing of a resistive memory device so as to provide that the device in its erased state has a greatly increased resistance as compared to a prior art approach. The annealing also provides that the device may be erased by application of any of a plurality of electrical potentials within an increased range of electrical potentials as compared to the prior art.

Erase, programming and leakage characteristics of a resistive memory device

In a method of providing an operating characteristic of a resistive memory device, material of an electrode thereof is selected to in turn provide a selected operating characteristic of the device. The material of the electrode may be reacted with material of an insulating layer of the resistive memory device to form a reaction layer, the selected operating characteristic being dependent on the presence of the reaction layer.

Method of selecting operating characteristics of a resistive memory device

In a memory device having first and second electrodes and active and passive layers between the electrodes, or a memory device having first and second electrodes and an insulating layer between and in contact with electrodes, the device may be programmed in the ionic mode by applying electrical potential across the electrodes in one direction, and may be programmed in the electronic charge carrier mode by applying electrical potential across electrodes in the opposite direction.

Method of programming memory device

A metal sulfide based non-volatile memory device is provided herein. The device is comprised of a substrate, a backplane, a planar memory media including a dense array of metal sulfide based memory cells, and a MEMS probe based actuator. The cells of the memory device are operative to be of two or more states corresponding to various levels of impedance. The MEMS actuator is operable to position micro/nano probes over the appropriate cells to enable reading, writing, and erasing the memory cells by applying a bias voltage.

Using organic semiconductor memory in conjunction with a MEMS actuator for an ultra high density memory

Systems and methods are disclosed that facilitate extending data retention time in a data retention device, such as a nanoscale resistive memory cell array, via assessing a resistance level in a tracking element associated with the memory array and refreshing the memory array upon a determination that the resistance of the tracking element has reached or exceeded a predetermined reference threshold resistance value. The tracking element can be a memory cell within the array itself and can have an initial resistance value that is substantially higher than an initial resistance value for a programmed memory cell in the array, such that resistance increase in the tracking cell will cause the tracking cell to reach the threshold value and trigger refresh of the array before data corruption/loss occurs in the core memory cells.

Use of periodic refresh in medium retention memory arrays

Systems and methods employing at least one constant current source to facilitate programming of an organic memory cell and/or employing at least one constant voltage source to facilitate erasing of a memory device. The present invention is utilized in single memory cell devices and memory cell arrays. Employing a constant current source prevents current spikes during programming and allows accurate control of a memory cell's state during write cycles, independent of the cell's resistance. Employing a constant voltage source provides a stable load for memory cells during erase cycles and allows for accurate voltage control across the memory cell despite large dynamic changes in cell resistance during the process.

Control of memory devices possessing variable resistance characteristics

A memory array includes first and second sets of conductors and a plurality of memory-diodes, each connecting in a forward direction a conductor of the first set with a conductor of the second set. An electrical potential is applied across a selected memory-diode, from higher to lower potential in the forward direction, intended to program the selected memory-diode. During this intended programming, each other memory-diode in the array has provided thereacross in the forward direction thereof an electrical potential lower than its threshold voltage. The threshold voltage of each memory-diode can be established by applying an electrical potential across that memory-diode from higher to lower potential in the reverse direction. By so establishing a sufficient threshold voltage, and by selecting appropriate electrical potentials applied to conductors of the array, problems related to current leakage and disturb are avoided.

Method of programming, reading and erasing memory-diode in a memory-diode array

In the present method of programming a memory device from an erased state, the memory device includes first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrodes. In the programming method, (i) an electrical potential is applied across the first and second electrodes from higher to lower potential in one direction to reduce the resistance of the memory device, and (ii) an electrical potential is applied across the first and second electrodes from higher to lower potential in the other direction to further reduce the resistance of the memory device.

Resistive memory device with improved data retention

An organic memory device comprising two electrodes having a selectively conductive decay media between the two electrodes provides a capability to control a persistence level for information stored in an organic memory cell. A resistive state of the cell controls a conductive decay rate of the cell. A high and/or low resistive state can provide a fast and/or slow rate of conductive decay. One aspect of the present invention can have a high resistive state equating to an exponential conductive decay rate. Another aspect of the present invention can have a low resistive state equating to a logarithmic conductive decay rate. Yet another aspect relates to control of an organic memory device by determining a power state and setting a resistive state of an organic memory cell based upon a current power state and/or an imminent power state.

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Palo Alto, CA, United States of America

Tzu-Ning Fang