Oki Electric Industry Co., Ltd.

Tuguto Maruko

Shinji Tanabe

A photomask includes a main mask pattern having first chip patterns and having a first size corresponding to a maximum exposure area of a projection exposure apparatus. The mask further includes a sub-mask pattern having second chip patterns different from the first chip patterns, having a second size smaller than the first size, and arranged adjacently to the main mask pattern.

Photomask and method for exposing chip pattern

The semiconductor device includes a multilevel interconnection formed on a semiconductor substrate. The multilevel interconnection includes a plurality of wiring layers each of which is insulated by an insulating layer. A metal member is formed as a shielding film in a same plane as a wiring layer. As a result, the shielding layer can be formed without increasing the number of process steps.

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Tokyo, Japan

Tuguto Maruko