Sumitomo Heavy Industries, Ltd.

Sumitomo Heavy Industries Co., Ltd.

Tsutomu Miyatake

Daigo Hotta

Yosuke Ito

Norihito Okada

Itsushi Iio

Shinji Terada

Toshiharu Tanaka

Kouji Seike

Kiminori Sakai

Hiroyasu Yato

Hajime Ono

Xin Zhang

Yuji Sato

An upper rotation body is rotatably attached on a lower travelling body. A storage battery module is loaded onto the upper rotation body. The storage battery module has a plurality of plate-shaped storage battery cells that are stacked in z direction when an xyz rectangular coordinate system is defined. At least one heat transfer plate is arranged between the storage battery cells. Pressing plates, which are arranged at both ends of the stack structure of the storage battery cells, apply a compressive force in the stacking direction to the storage battery cells. A first wall plate and a second wall plate pinch the stacked body in the y-direction and are fixed to the pressing plates. The positions of the heat transfer plates are restricted with respect to the first wall plate and the second wall plate.

Shovel

A mold clamping device includes a first fixed member to which a stationary mold is to be attached; a first movable member to which a movable mold is to be attached; a second movable member configured to move together with the first movable member; a second fixed member provided between the first movable member and the second movable member; a mold clamping force generating mechanism configured to generate a mold clamping force due to an electromagnetic force between the second movable member and the second fixed member; and a mold clamping force amplifying mechanism configured to amplify the mold clamping force generated by the mold clamping force generating mechanism.

Mold clamping device

A stage base comprises a base body, an elevator, and a shifter. The base body has a bottom face facing a reference surface. The elevator is attached to the base body and operative to move the base body in a vertical direction with respect to the reference surface. The shifter is attached to the elevator. The shifter enables the base body to move along the reference surface.

Stage base, substrate processing apparatus, and maintenance method for stage

A wafer has first and second wafer marks formed thereon, and a mask has first and second mask marks formed thereon. The first and second mask marks are in correspondence with the first and second wafer marks, the first and second mask marks and the first and second wafer marks constituting first and second alignment mark groups. First and second illumination optical system apply illumination light to the first and second alignment mark groups. First and second observation optical systems obtains images formed by scattered light from the first and second alignment mark groups. Optical axes of the first and second observation optical systems are oblique relative to an exposure surface, and the optical axes vertically projected upon the exposure surface cross at a right angle a straight line interconnecting the first and second wafer marks. A controller detects a size of the wafer and mask in accordance with images obtained by the first and second observation optical systems. High precision position alignment is possible even during exposure without lowering throughput.

Apparatus for detecting positions of wafer and mask and deformation error detecting method

The exposure surface of a wafer to be exposed is formed with a wafer mark having edges for scattering incident light. The edge of the wafer mark has a curved portion whose image vertically projected upon a plane in parallel to the exposure surface has a curved shape. The surface of an exposure mask is formed with a mask mark having edges for scattering incident light. The edge of the exposure mask has a curved portion whose image vertically projected upon a plane in parallel to the surface of the exposure mask has a curved shape. The wafer and exposure mask are juxtaposed with and spaced apart by a gap from the exposure surface of the wafer. Illumination light is applied to the curved portions of the edges of the wafer and mask marks. Light scattered from the wafer and mask marks is observed along a direction oblique to the exposure surface to thereby detect a relative position of the wafer and exposure mask.

Position detection technique applied to proximity exposure

A wafer with an exposure surface having a wafer mark formed thereon for scattering incidence light for position alignment and an exposure mask with a mask surface having a mask mark formed thereon for scattering incidence light for position alignment, are disposed facing each other with a predetermined distance being set between the exposure surface and the mask surface. An illumination optical system applies illumination light to the wafer mark and the mask mark along an optical axis which is oblique relative to the exposure surface. An observation optical system focuses scattered light from the wafer mark and mask mark on a light reception surface. The optical axis of the observation optical system is slanted in a direction opposite to the direction of the optical axis of the illumination optical system, relative to a normal direction to the exposure surface of the wafer. Regular reflection light of the illumination light applied to the wafer and the mask is set so as not to become incident upon the light reception surface. A controller controls to detect a positional relation between the wafer and the mask in accordance with images formed by scattered light from the wafer mark and mask mark. A contract between a background and an image formed by scattered light from alignment marks is increased to easily detect the positions of the wafer and mask.

Position detecting method and apparatus using optical system with oblique optical axes

A wafer with an exposure surface and an exposure mask are disposed, directing the exposure surface to the exposure mask with a gap being interposed therebetween, the wafer having a position aligning wafer mark formed on the exposure surface, the wafer mark having a linear or point scattering source for scattering incident light, and the exposure mask having a position aligning mask mark having a linear or point scattering source for scattering incident light. A relative position of the wafer and exposure mask is detected by applying illumination light to the wafer mark and mask mark and observing scattered light from the scattered sources of the wafer mark and mask mark.

Position detecting method with observation of position detecting marks

Exposure mask adapted for position detecting with oblique incident light

A double-focus detector utilizing a lens system having axial chromatic aberration vertically illuminates a mask and a wafer disposed at a minute interval in the direction of the optical axis of the lens system. The mask is illuminated with a single ray of wavelength 500 nm or more and the wafer is illuminated with a given band flux or a plurality of rays of wavelength larger than that selected for the mask and one of focus planes of the lens system is an image forming plane of the single ray and the other focus plane of the lens system is the same image forming plane of the given band ray or the plurality of rays so that the relative position between the mask and the wafer can be detected.

Growing community of inventors

Yokosuka, Japan

Tsutomu Miyatake