Mitsubishi Denki Kabushiki Kaisha

Mitsbuishi Denki Kabushiki Kaisha

Toshio Murotani

Hiroaki Morikawa

Satoshi Arimoto

Yoshinori Matsuno

Hisao Kumabe

Yoshitatsu Kawama

Etsuji Oomura

Makoto Ishii

A process of forming electrodes is simplified during modularizing of a solar battery. According to the manufacturing method and the manufacturing apparatus, a thin solar battery is manufactured at a reduced cost and with a better yield. Using a robot which includes a suction chip which can handle a semiconductor film 2 without any damage which is separated from a particular substrate 1, the semiconductor films 2 are each accurately placed through a transparent resin 3 onto a glass substrate 7 which serves as a window of a solar battery, and p-type and n-type electrodes are printed at a time on the semiconductor films 2 which are arranged. Further, since a monolithic tab electrode is soldered to connect the electrodes, the manufacturing processes of the solar battery are simplified.

Method of and apparatus for manufacturing thin solar battery

An infrared imaging device includes an infrared detector element having a pin structure which detects infrared rays 8 to 12 macrons in wavelength. The pin structure comprises a multiquantum well structure as an intrinsic layer including a plurality of Al.sub.y Ga.sub.1-y As quantum well layers sandwiched by respective Al.sub.x Ga.sub.1-x As quantum barrier layers (x&gt;y) and a p type Al.sub.x Ga.sub.1-x As layer and an n type Al.sub.x Ga.sub.1-x As layer sandwiching the intrinsic layer. An infrared imaging device includes a plurality of picture units, each picture unit including an infrared detector element and a corresponding GaAs FET having a source region connected with the n layer of the infrared detector element on the same substrate. The picture unit and corresponding FET may be monolithically integrated on the same substrate with an n type channel in the substrate interconnecting the picture unit and the corresponding FET.

Method of making an infrared imaging device

An infrared imaging device includes an infrared detector element having a pin structure which detects infrared rays 8 to 12 microns in wavelength. The pin structure comprises a multi-quantum well structure as an intrinsic layer including a plurality of Al.sub.y Ga.sub.1-y As quantum well layers sandwiched by respective Al.sub.x Ga.sub.1-x As quantum barrier layers (x&gt;y) and a p type Al.sub.x Ga.sub.1-x As layer and an n type Al.sub.x Ga.sub.1-x As layer sandwiching the intrinsic layer. An infrared imaging device includes a plurality of picture units, each picture unit including an infrared detector element and a corresponding GaAs FET having a source region connected with the n layer of the infrared detector element on the same substrate. The picture unit and corresponding FET may be monolithically integrated on the same substrate with an n type channel in the substrate interconnecting the picture unit and the corresponding FET.

Infrared imaging device

A p type GaAlAs layer is disposed on an n type substrate and then n type GaAlAs, GaAs and GaAlAs layers are successively grown on the p type GaAlAs layer. Zn is diffused into predetermined portions of those n type layers to a depth reaching the GaAlAs layer to form pn junctions between the original n type regions of the layers and their regions converted to the p form the n type conductivity. The pn junction formed in the GaAs layer serves as a light emitting region.

Growing community of inventors

Itami, Japan

Toshio Murotani