Average Co-Inventor Count = 2.64
ph-index = 4
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Tokyo Ohka Kogyo Co., Ltd. (11 from 1,233 patents)
2. Toyko Ohka Kogyo Co., Ltd. (2 from 5 patents)
13 patents:
1. 9436084 - Positive-working photoresist composition for thick film formation
2. 7951522 - Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
3. 7927778 - Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
4. 7462436 - Positive photoresist composition and method of forming resist pattern
5. 7419769 - Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
6. 7169532 - Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
7. 7132213 - Positive photoresist composition and method of forming resist pattern
8. 7129018 - Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
9. 7081327 - Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
10. 7063934 - Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
11. 6838229 - Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same
12. 6641972 - Positive photoresist composition for the formation of thick films, photoresist film and method of forming bumps using the same
13. 5908734 - Image formation method with a post exposure heating step