Kokusai Electric Co., Ltd.

Toshikazu Karino

Yukinori Aburatani

Yuji Yoshida

Takeshi Sugimoto

Hisashi Yoshida

Ryoji Saito

Kazuhito Ikeda

Shinichiro Watahiki

Shuji Yonemitsu

Hideo Shimura

Shoichiro Izumi

Yasuhiro Harada

Koji Tometsuka

Tohru Yoshida

Makoto Ozawa

Fumihide Ikeda

Satoshi Kakizaki

Mikio Koizumi

A substrate processing apparatus comprises a substrate transfer chamber; a substrate processing chamber disposed on a first side wall of the substrate transfer chamber; an intermediate substrate holding chamber disposed on a second side wall of the substrate transfer chamber; a first substrate holder disposed within the intermediate substrate holding chamber; a second substrate holder disposed within the substrate processing chamber; a first substrate transfer robot, disposed within the substrate transfer chamber, for transferring the substrate between the substrate processing chamber and the intermediate substrate holding chamber; a first gate valve disposed between the substrate processing chamber and the substrate transfer chamber; a second gate valve disposed between the substrate transfer chamber and the intermediate substrate holding chamber; an atmospheric pressure section located opposite to the substrate transfer chamber with respect to the intermediate substrate holding chamber; a third valve disposed between the intermediate substrate holding chamber and the atmospheric pressure section; a cassette holder disposed within the atmospheric pressure section; and a second substrate transfer robot disposed within the atmospheric pressure section, for transferring the substrate between a cassette held in the cassette holder and the intermediate substrate holding chamber.

Substrate transferring mechanism

Substrate processing apparatus with a processing chamber, transfer

A substrate processing apparatus comprises a substrate transfer chamber; a plurality of substrate processing chambers disposed on a first side wall of the substrate transfer chamber and stacked in the vertical direction; a plurality of first gate valves, each being disposed between each of the substrate processing chambers and the substrate transfer chamber; a substrate accommodating chamber disposed on a second side wall of the substrate transfer chamber; a substrate transfer device, disposed within the substrate transfer chamber, for transferring the substrate under reduced pressure between the substrate processing chambers and the substrate accommodating chamber; an elevator disposed outside the substrate transfer chamber and comprising a stationary portion and an elevating portion which is vertically movable with respect to the stationary portion; a rigid connecting member capable of moving through a through-hole formed in a predetermined face of the substrate transfer chamber, the rigid connecting member mechanically connecting the elevating portion and the substrate transfer device through the through-hole; and a sealing member for establishing a hermetic vacuum seal between the predetermined surface and the connecting member which penetrates through the through-hole.

Substrate processing apparatus

In the semiconductor manufacturing apparatus according to the present invention, there are provided a cassette stocker for accommodating wafer cassettes loaded with wafers, a reaction furnace provided with heating means, a reaction gas introducing means for introducing reaction gas into the reaction furnace, a gas discharging means for discharging exhaust gas in the reaction furnace, a boat for supporting wafers, a buffer cassette stocker for storing unprocessed wafers, a boat elevating means for inserting the boat into and retrieving the boat from the reaction furnace, a wafer transfer means for transferring wafers between the boat and the wafer cassette accommodated on the cassette stocker, and a wafer cassette transfer means for transferring wafer cassettes between the buffer cassette stocker and the cassette stocker, and the buffer cassette stocker is enclosed to provide an antioxidation area to prevent natural oxidation of the wafers in standby status.

Semiconductor wafer reaction furnace with wafer transfer means

A wafer transfer method and mechanism in a vertical CVD diffusion apparatus and a control device for the method and mechanism. The vertical-type CVD diffusion apparatus has a boat containing many wafers in a horizontal orientation, stacked vertically. Product wafers are transferred to the boat five by five, dummy wafers are transferred five by five or a fraction less than five, and monitor wafers are inserted one by one between a block of the product wafers and another block of the product wafers, or a block of the dummy wafers.

Wafer transfer mechanism in vertical CVD diffusion apparatus

A wafer transfer method and mechanism in a vertical CVD diffusion apparatus and a control device for the method and mechanism. The vertical-type CVD diffusing apparatus has a boat containing many wafers in a horizontal orientation, stacked vertically. Product wafers are transferred to the boat five by five, dummy wafers are transferred five by five or a fraction less than five, and monitor wafers are inserted one by one between a block of the product wafers and another block of the product wafers, or a block of the dummy wafers.

Wafer transfer method in vertical CVD diffusion apparatus

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Tokyo, Japan

Toshikazu Karino