Tokyo Ohka Kogyo Co., Ltd.

Toshihiro Yamaguchi

Masahiro Masujima

Kenji Maruyama

Ken Miyagi

Kousuke Doi

Kazuyuki Nitta

Masaki Kurihara

Satoshi Niikura

Satoshi Shimatani

Hiroshi Shimbori

Sachiko Yoshizawa

A positive resist composition for forming a thick-film resist having a film thickness of 1 to 15 &#x3bc;m, the composition comprising: a resin component (A) that includes a polymer compound (A1), which has a weight average molecular weight of 20,000 to 50,000, and includes a structural unit (a1) derived from a hydroxystyrene and a structural unit (a2) derived from an acrylate ester containing an acid dissociable, dissolution inhibiting group, an acid generator component (B) that generates acid upon exposure and includes an onium salt-based acid generator having an anion moiety represented by general formula (I): R&#x2033;SO(wherein, R&#x2033; represents a linear or branched alkyl group or fluoroalkyl group of 4 carbon atoms), and a nitrogen-containing organic compound (D) that includes a tertiary aliphatic amine.

Positive resist composition for forming thick-film resist, thick-film resist laminate, and method of forming resist pattern

The present invention provides a chemical amplification type positive photoresist composition which is excellent in storage stability as a resist solution in a bottle. A novolak resin or a hydroxystyrenic resin is reacted with a crosslinking agent to give a slightly alkali-soluble or alkali-insoluble resin having such a property that solubility in an aqueous alkali solution is enhanced in the presence of an acid, which is then dissolved in an organic solvent, together with (B) a compound generating an acid under irradiation with radiation to obtain a chemical amplification type positive photoresist composition wherein the content of an acid component is 10 ppm or less.

Chemically amplified positive photo resist composition and method for forming resist pattern

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Kawasaki, Japan

Toshihiro Yamaguchi