Canon Kabushiki Kaisha

Dai Nippon Printing Co., Ltd.

E.i. Dupont De Nemours and Company

Hitachi Techno Engineering Co., Ltd.

Dai Nippon Printingco., Ltd.

Ganon Kabushiki Kaisha

Sony Mobile Communications Japan, Inc.

Toshihiko Takeda

Tetsuya Kaneko

Ichiro Nomura

Katsunari Obata

Hidetoshi Suzuki

Yoshikazu Banno

Takeo Tsukamoto

Hiroyuki Nishimura

Masahiko Okunuki

Hisaaki Kawade

Keisuke Yamamoto

Ken Eguchi

Yutaka Matsumoto

Isamu Shimoda

Kiyoshi Takimoto

Akira Suzuki

Hiroshi Matsuda

Yoshihiro Yanagisawa

Mamoru Miyawaki

Haruki Kawada

Yoshiyuki Osada

Aoji Isono

Masato Yamanobe

Chieko Mihara

Etsuro Kishi

Tatsuya Iwasaki

Yasue Sato

Takao Yonehara

Takeshi Ichikawa

Toshihiko Miyazaki

Atsushi Maki

Ryo Kuroda

Kiyoshi Sakai

Takashi Iwaki

Masataka Yamashita

Miki Tamura

Norio Kaneko

Shinya Mishina

Masaru Kamio

Kazuya Miyazaki

Akira Shimizu

Toshihiko Ouchi

Kunihiro Sakai

Takeshi Nakamura

Katsunori Hatanaka

Takahiro Oguchi

Hideo Kato

Toshimitsu Kawase

Sotomitsu Ikeda

Toshiyuki Takahashi

Yoshinori Hirobe

Seishiro Yoshioka

Kojiro Yokono

Hiroshi Kawasaki

Masato Ushikusa

Hideyuki Kawagishi

Noritake Suzuki

Eiji Yamaguchi

Haruhito Ono

Hiroaki Toshima

Yasuyuki Todokoro

Naoto Nakamura

Yasuhiro Hamamoto

Kazunori Oda

Hideyuki Okamoto

Takuto Moriguchi

Koki Nukanobu

Yozo Kosaka

Michiyo Nishimura

Yuji Kasanuki

Tomoko Maruyama

Hiroyoshi Kishi

Yoko Nakamura

Hiroyoshi Nakajima

Toyoko Kobayashi

Toshikazu Onishi

Terutoshi Momose

Kiyotaka Takematsu

Nobuaki Kimura

Tsutomu Ikeda

Osamu Takamatsu

Masato Minami

Mitsuaki Seki

Tamaki Kobayashi

Hitoshi Oda

Yuko Morikawa

Kazumi Tanaka

Yoshihiro Kobayashi

Hironobu Mizuno

Hideshi Kawasaki

Kazuhiro Jindai

Takeo Ono

Susumu Yasuda

Shunichi Shido

Masato Okada

Kazuhiro Sando

Katsuhiko Shinjo

Shinichi Kawate

Masahiro Okuda

Masahiro Tagawa

A vapor chamber in which an enclosed space is formed, and a working fluid is sealed in this space, the enclosed space including: a plurality of condensate flow paths through which a fluid that is the working fluid in a condensing state flows; and vapor flow paths through which a vapor that is the working fluid in a vaporizing state flows, wherein each of projecting parts with which each of the vapor flow paths is provided has a projecting amount varying in an extending direction of the vapor flow paths; a pitch for opening parts that allow the vapor flow paths and the condensate flow paths to communicate varies in the extending direction of the vapor flow paths; or wall parts that separate the flow paths each have a given relationship with a transverse cross section of a given flow path.

Vapor chamber and electronic device

A wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a first vapor flow channel portion, a liquid flow channel portion provided on the second body surface, and the second vapor flow channel portion provided on the first body surface. The sheet body includes a land portion having the longitudinal direction being a first direction, and the first vapor flow channel portion is disposed around the land portion. The second vapor flow channel portion includes a vapor flow channel groove extending from one of side edges of the land portion to the other side edge in a second direction orthogonal to the first direction.

Wick sheet for vapor chamber, vapor chamber, and electronic apparatus

A liquid flow path portion of a vapor chamber according to the present invention includes a plurality of main flow grooves which each extend in the first direction and through which working fluid in liquid form passes. A convex array which includes a plurality of liquid flow path convex portions arranged in the first direction via a communicating groove, is provided between a pair of the main flow grooves adjacent to each other. Each of the communicating grooves allows communication between the corresponding pair of the main flow grooves. The width of the communicating groove is larger than the width of the main flow groove.

Vapor chamber, electronic device, metallic sheet for vapor chamber and manufacturing method of vapor chamber

Vapor chamber with condensate flow paths disposed on wall parts

A wick sheet for a vapor chamber is sandwiched between a first sheet and a second sheet of the vapor chamber that encloses a working fluid. The wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a penetration space that penetrates the sheet body, a first groove assembly that is disposed on the second body surface and that communicates with the penetration space, and the second groove assembly that is disposed on the first body surface and that communicates with the penetration space. The flow channel cross-sectional area of a second mainstream groove of the second groove assembly is greater than the flow channel cross-sectional area of a first mainstream groove of the first groove assembly.

A method for producing a vapor deposition mask capable of satisfying both enhancement in definition and reduction in weight even when a size increased, a method for producing a vapor deposition mask device capable of aligning the vapor deposition mask to a frame with high precision, and a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition are provided. A metal mask provided with a slit, and a resin mask that is positioned on a front surface of the metal mask and has openings corresponding to a pattern to be produced by vapor deposition arranged by lengthwise and crosswise in a plurality of rows, are stacked.

Vapor deposition mask with metal plate

A method for producing a frame-equipped vapor deposition mask sequentially includes preparing a vapor deposition mask including a metal mask having a slit and a resin mask having an opening corresponding to a pattern to be produced by vapor deposition at a position overlapping the slit, the metal mask and the resin mask being stacked, retaining a part of the vapor deposition mask by a retainer and stretching the vapor deposition mask retained by the retainer outward, and fixing the vapor deposition mask in a state of being stretched to a frame having a through hole. During stretching, any one or both adjustments of a rotating adjustment and a moving adjustment of the vapor deposition mask are performed with respect to the vapor deposition mask in the state of being stretched or with the vapor deposition mask being stretched.

Method for producing frame-equipped vapor deposition mask, stretching apparatus, apparatus for producing organic semiconductor device and method for producing organic semiconductor device

A vapor deposition mask includes a metal mask and a resin mask having an opening. An inner wall surface for composing the opening has an inflection point in a thicknesswise cross section of the resin mask. When an intersection of a first surface, not facing the metal mask, of the resin mask and the inner wall surface is set to be a first intersection, an intersection of a second surface, facing the metal mask, of the resin mask and the inner wall surface is set to be a second intersection, and there is set a first inflection point first positioned from the first intersection toward the second intersection, an angle formed by a line connecting the first intersection and the first inflection point and the first surface is larger than an angle formed by a line connecting the first inflection point and the second intersection and the second surface.

Vapor deposition mask, frame-equipped vapor deposition mask, and method for producing organic semiconductor element

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal maskin which a plurality of slitsare provided and a resin maskare stacked. Openingsrequired for composing a plurality of screens are provided in the resin mask. The openingscorrespond to a pattern to be produced by vapor deposition. Each of the slitsis provided at a position of overlapping with an entirety of at least one screen.

Vapor deposition mask, vapor deposition mask preparation body, method for producing vapor deposition mask, and method for producing organic semiconductor element

There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal maskin which a slitis provided and a resin maskin which openingscorresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slitare stacked, and the metal maskhas a general regionin which the slitis provided and a thick regionlarger in thickness than the general region.

A vapor deposition mask capable of correctly performing confirmation of whether a shape pattern of openings formed in a resin mask is normal or similar confirmation while satisfying both high definition and lightweight, a vapor deposition mask preparation body for obtaining the vapor deposition mask, a frame-equipped vapor deposition mask including the vapor deposition mask, and a method for producing an organic semiconductor element using the frame-equipped vapor deposition mask. The aforementioned problem is solved by using, in a vapor deposition mask including a metal mask in which a through hole is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the through hole, the metal mask and the resin mask being stacked, wherein the resin mask has about 40% or less of light ray transmittance at a wavelength of about 550 nm.

Vapor deposition mask, frame-equipped vapor deposition mask, vapor deposition mask preparation body, and method for producing organic semiconductor element

In a method for forming a vapor deposition pattern using a vapor deposition mask provided with a plurality of openings corresponding to a pattern that is produced by vapor deposition, and forming a vapor deposition pattern in a vapor deposition target, the method includes a close contact step of disposing the vapor deposition mask on one surface side of the vapor deposition target, disposing a pressing member and a magnetic plate in layer in this order on the other surface side of the vapor deposition target, and bringing the vapor deposition target and the vapor deposition mask into close contact with each other by using magnetism of the magnetic plate, and a vapor deposition pattern forming step of causing a vapor deposition material released from a vapor deposition source to adhere to the vapor deposition target through openings after the close contact step, and forming the vapor deposition pattern in the vapor deposition target.

Method for forming vapor deposition pattern, pressing-plate-integrated type pressing member, vapor deposition apparatus, and method for producing organic semiconductor element

A vapor deposition mask preparation body in which a metal mask is provided on one surface of a resin plate for obtaining a resin mask, and a protective sheet with peel strength not less than about 0.0004 N/10 mm and less than about 0.2 N/10 mm in conformity with JIS Z-0237:2009 is provided on the other surface of the resin plate is prepared, with respect to the vapor deposition mask preparation body, the resin plate is irradiated with laser light from the metal mask side to form a resin mask opening corresponding to a pattern to be produced by vapor deposition in the resin plate, and the protective sheet is peeled off from the resin mask in which the resin mask opening corresponding to the pattern to be produced by vapor deposition is formed.

Method for producing vapor deposition mask, vapor deposition mask preparation body, method for producing organic semiconductor element, method for producing organic EL display, and vapor deposition mask

Growing community of inventors

Tokyo, Japan

Toshihiko Takeda