Tokyo Ohka Kogyo Co., Ltd.

Toshiaki Tachi

Mitsuo Hagihara

Kenji Maruyama

Ken Miyagi

Tomoyuki Ando

Yasushi Washio

Akira Katano

Eiichi Shimura

A method for producing a thick film photoresist pattern including laminating a thick photoresist layer including a chemically amplified positive-type photoresist composition for thick film on a support; irradiating the thick photoresist layer; and developing the thick photoresist layer to obtain a thick film resist pattern; in which the composition includes an acid generator, a resin whose alkali solubility increases by the action of an acid, and an organic solvent having a boiling point of at least 150&#xb0; C. and a contact angle on a silicon substrate of no greater than 18&#xb0;, in an amount of at least 40% by mass with respect to total mass of the organic solvent.

Method for producing thick film photoresist pattern

(i) As a primary reaction, m-cresol is allowed to react with propionaldehyde in the presence of an acid catalyst and thereby yields a polymer having a weight average molecular weight Mw of 200 to 500 and a molecular weight distribution Mw/Mn of 1.7 or less, and (ii) as a secondary reaction, the polymer is allowed to react with 3,4-xylenol and formaldehyde and thereby yields a novolak resin having an Mw of 1000 to 20000. By adding a specific photosensitizer, the novolak resin yields a positive photoresist composition.

Novolak resin, production process thereof and positive photoresist composition using the novolak resin

Positive photoresist composition

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Kanagawa, Japan

Toshiaki Tachi