Jsr Corporation

Mitsubishi Denki Kabushiki Kaisha

Ykk Corporation

Tomoyuki Matsumoto

Naoki Nishiguchi

Hirokazu Sakakibara

Fumio Kouzai

Kenichi Haramoto

Ayako Endo

Kazuto Watanabe

Takuhiro Taniguchi

Akira Ishii

Hirokazu Itou

A photosensitive resin composition contains at least one compound selected from the group consisting of compound (C1) represented by formula (C1), compound (C2) represented by formula (C2), and a multimer of the compound (C2). Z each independently represents an oxygen atom or a sulfur atom. Reach independently represents a monovalent hydrocarbon group or a group obtained by substituting at least one hydrogen atom in the monovalent hydrocarbon group with a mercapto group, and at least one Ris a group obtained by substituting at least one hydrogen atom in the monovalent hydrocarbon group with a mercapto group when p is 1 and when p is an integer of 2 or more and all of Z is an oxygen atom. Rand Reach independently represent a divalent hydrocarbon group, and Rrepresents a glycoluril ring structure or an isocyanul ring structure.

Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product

A photosensitive resin composition contains polymer (A) having an acid dissociative group, photoacid generator (B), and solvent (C), the solvent (C) containing 80 to 95% by mass of propylene glycol monomethyl ether acetate (C1) and 5 to 18% by mass of 3-methoxybutyl acetate (C2), a content ratio of other solvent (C3) in the solvent (C) being 0 to 10% by mass, and a content ratio of the solvent (C) contained in the photosensitive resin composition being less than 60% by mass.

Photosensitive resin composition, method for producing resist pattern film, method for producing plated formed product, and method for producing tin-silver plated-formed product

The present photosensitive resin composition includes a polymer (A) having a structural unit (a1) represented by a formula (a1), a structural unit (a2) represented by a formula (a2), and a structural unit (a3) represented by a formula (a3), and a photoacid generator (B). In the formulae (a1) to (a3), R, R, and Reach independently represent an organic group having 1 to 10 carbon atoms; Rrepresents a substituted or non-substituted alkyl group having 1 to 10 carbon atoms; Rrepresents a hydrogen atom, a substituted or non-substituted alkyl group having 1 to 10 carbon atoms, or a halogen atom; Rand Reach independently represent an acid dissociable group; Rrepresents a hydroxyaryl group; and l, m and n independently represent an integer from 0 to 10.

Photosensitive resin composition, method for forming resist pattern, method for manufacturing plated molded article, and semiconductor apparatus

A method for producing a plated shaped structure, includes applying a photosensitive resin composition on a substrate to form a photosensitive resin coating film. The photosensitive resin composition includes: (A) a resin whose solubility in alkali is capable of being increased by an action of an acid; (B) a photoacid generator; and (C) a compound which is capable of being decomposed by an action of an acid to form a primary or secondary amine. The photosensitive resin coating film is exposed to light. The photosensitive resin coating film is developed after the exposing to light to form a resist pattern. A plating process is performed using the resist pattern as a mask.

Method for producing plated shaped structure and photosensitive resin composition for production of plated shaped structures

Printer inksheet

Growing community of inventors

Tokyo, Japan

Tomoyuki Matsumoto