Tokyo Electron Limited

Tomoki Okazawa

Katsunori Ichino

Yuta Nishiyama

Masanobu Watanabe

Takeshi Tobimatsu

A substrate processing apparatus includes: a rotary holder configured to hold and rotate a substrate; a liquid supplier including a nozzle that ejects a processing liquid; a driver configured to move the nozzle between a center of the substrate and a peripheral portion of the substrate; and a controller configured to: execute a supply control to supply the processing liquid to the surface of the substrate so as to form a supply trajectory in a spiral shape, by ejecting the processing liquid from the nozzle while rotating the substrate and moving the nozzle from the center of the substrate toward the peripheral portion of the substrate; and when executing the supply control, gradually reduce an ejection amount of the processing liquid per unit area on the surface of the substrate, at least in a portion forming an outermost periphery of the supply trajectory.

Substrate processing apparatus and substrate processing method

A liquid processing apparatus includes a processing liquid supply including a nozzle configured to discharge a processing liquid; a nozzle mover configured to move the nozzle between a coating position and a standby position; a suction unit including a suction opening toward a leading end surface of the nozzle located at the standby position; a cleaning unit configured to clean the leading end surface of the nozzle located at the standby position with a cleaning liquid; and a control device. The control device controls the processing liquid supply to discharge the processing liquid in a state that the nozzle is located at the standby position. The control device controls the suction unit to suck the processing liquid. The control device controls the cleaning unit to supply the cleaning liquid toward the standby position to clean the nozzle. The control device controls the suction unit to suck the cleaning liquid.

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Koshi, Japan

Tomoki Okazawa