Jsr Corporation

Jm Energy Corporation

Tomohiro Utaka

Atsushi Nakamura

Toru Kimura

Hiroki Nakagawa

Hiroshi Ikeda

Yukio Nishimura

Hiroaki Nemoto

Masayoshi Suzuki

Ryo Tanaka

Takashi Chiba

Hirokazu Sakakibara

Hideaki Takase

Yuuichi Eriyama

Hiroshi Dougauchi

Kentarou Tamaki

Hiromitsu Nakashima

Toshihiro Hayashi

Yuji Yada

Masayuki Endo

Akira Nishikawa

Eiji Yoneda

Takahiro Shimizu

Tooru Kimura

Jun Huangfu

The electrode active material includes a carbon material having a volume of macropores with 50 to 400 nm pore diameters of 0.05 to 0.40 cc/g. The carbon material may be a composite carbon material that contains a carbon material forming a core, and a coating carbon material covering at least part of the core-forming carbon material.

Electrode active material, electrode and electrical storage device

An immersion upper layer film composition includes a resin and a solvent. The resin forms a water-stable film during irradiation and is dissolved in a subsequent developer. The solvent contains a monovalent alcohol having 6 or less carbon atoms. The composition is to be applied to form a coat on a photoresist film in an immersion exposure process in which the photoresist film is irradiated through water provided between a lens and the photoresist film.

Immersion upper layer film forming composition and method of forming photoresist pattern

A radiation-sensitive composition includes a polymer composition and a radiation-sensitive acid generator. The polymer composition includes a first polymer and a second polymer. The first polymer includes a repeating unit shown by a following formula (1). The second polymer includes a repeating unit shown by a following formula (2) and does not include a repeating unit shown by the formula (1). 

Radiation-sensitive composition

A radiation-sensitive resin composition excelling in basic properties as a resist such as sensitivity, resolution, and the like, having a wide depth of focus (DOF) to both a line-and-space pattern and an isolated space pattern, and exhibiting a minimal line width change due to fluctuation of a bake temperature, and having a small line width limit in which the line pattern destroying phenomenon does not occur, and a lactone-containing copolymer useful as a resin component of the composition are provided. The lactone-containing copolymer is represented by a copolymer of the following compounds (1-1), (2-1), and (3-1).  The radiation-sensitive resin composition comprises (a) the lactone-containing copolymer and (b) a photoacid generator.

Lactone copolymer and radiation-sensitive resin composition

A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which includes at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000. 

Copolymer and top coating composition

An immersion upper layer film composition is provided which exhibits sufficient transparency for the exposure wavelength 248 nm(KrF) and 193 nm(ArF), can form a protective film on the photoresist film without being intermixed with the photoresist film, is not eluted into water used during immersion exposure to maintain a stable film, and can be easily dissolved in an alkaline developer. The composition applied to coat on the photoresist film when using an immersion exposure device which is irradiated through water provided between a lens and the photoresist film, the composition comprises a resin forming a water-stable film during irradiation and being dissolved in a subsequent developer, and a solvent containing a monovalent alcohol having 6 or less carbon atoms, and the resin contains a resin component having an alcoholic hydroxyl group on the side chain containing a fluoroalkyl group on at least the carbon atom of &#x3b1;-position.

Upper layer film forming composition for liquid immersion and method of forming photoresist pattern

A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which comprises at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000, wherein at least one of Rand Ris a fluoroalkyl group having 1 to 4 carbon atoms and Rin the formula (2) represents a fluoroalkyl group having 1 to 20 carbon atoms.

A radiation-sensitive resin composition for forming optical waveguides, which comprises (A) a novolac type epoxy resin and (B) a photo-acid generator. The composition is used as materials for a core portionof an optical waveguide, and the like. In the composition, component (A) is represented by the following general formula (1). (In the formula, Ris a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aralkyl group; and n is an integer from 0 to 10.) The composition is excellent in patterning properties and the like in curing process, and is also excellent in heat resistance, transmission characteristics, and long-term reliability after the optical waveguide has been formed.

Photosensitive resin composition for optical waveguide formation and optical waveguide

A radiation-curable composition containing (A) hydrolyzates of hydrolyzable silane compounds represented by general formula (1): (R)(R)Si(X)(wherein Ris a non-hydrolyzable organic group having 1 to 12 carbon atoms that contains fluorine atoms, Ris a non-hydrolyzable organic group having 1 to 12 carbon atoms (but excluding ones that contain fluorine atoms), X is a hydrolyzable group, p is an integer of 1 or 2, and q is an integer of 0 or 1) and condensates of such hydrolyzates, and (B) a photo acid generator, wherein the ratio of silanol (Si&#x2014;OH) groups in the composition is 0.1 to 0.5 out of all the bonding groups on Si. With such a composition, the waveguide loss is low for light having a wavelength in a broad range from the visible region to the near infrared region, and moreover the cracking resistance, the patterning ability upon irradiation with radiation, and so on are excellent.

Radiation-curable composition, optical waveguide and method for formation thereof

A positive-tone radiation-sensitive composition including: (A) at least one compound selected from the group consisting of a hydrolyzable silane compound represented by general formula (R)Si(X)(wherein Ris a non-hydrolyzable organic group having 1 to 12 carbon atoms, X is a hydrolyzable group, and p is an integer from 0 to 3), hydrolyzates thereof and condensates thereof; (B) a photoacid generator; and (C) a basic compound. A cured product that is excellent in terms of pattern precision and so on can be obtained by using the composition. The composition can be used as a material for forming optical waveguides.

Positive type radiosensitive composition and method for forming pattern

A process for forming a cured film comprising the steps of: coating an alkali-soluble thermosetting resin composition on a substrate, and baking it; coating a radiation sensitive resin composition on the coated film, and baking it, exposing the radiation sensitive resin composition on the substrate to radiation through a predetermined mask and baking it; carrying out development with an alkaline developer; immersing the substrate carrying the coated films in a stripping solution; and heating the alkali-soluble thermosetting resin remaining on the substrate to obtain a cured film pattern.

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Tokyo, Japan

Tomohiro Utaka