Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Kabushiki Kaisha Topcon

Nuflare Technology, Inc.

Tomohide Watanabe

Toshiyuki Watanabe

Toru Tojo

Hiromu Inoue

Hideo Tsuchiya

Hiroyuki Ikeda

Eiji Yamanaka

Mitsuo Tabata

Kiminobu Akeno

Masana Minami

Ryoji Yoshikawa

Masami Ikeda

Makoto Taya

Hiroyuki Tanizaki

Satoshi Endo

Chikara Itoh

A pattern inspection device according to the embodiment, includes: an image picking-up portion for picking-up an image of a pattern formation member in which a plurality of opening patterns are formed so as to obtain a picked-up image of the pattern formation member; a reference image obtaining portion for obtaining a reference image used for comparing with the picked-up image; and a pattern defect detecting portion for matching the center locations of the opening pattern images respectively between the picked-up image and the reference image, forming difference images of the opening pattern images between the picked-up image and the reference image per the opening pattern and detecting the defect of the opening pattern base on the difference images.

Pattern inspection device and method of inspecting pattern

A focusing device comprises a first imaging optical system, a second imaging optical system which splits the optical image in the direction of an AF sensor and further splits the optical image so that a front focus image in which the point that is in focus is in front of the optical image on the inspecting sensor and a back focus image in which the point that is in focus is behind the optical image on the inspecting sensor are formed on the AF sensor, a focus detecting circuit which detects an optimum focus position on the basis of a high-frequency component of a front sensor image in a front focus position and a high-frequency component of a back sensor image in a back focus position, and a focus control circuit which controls the focusing of the first imaging optical system on the basis of the focus position.

Focusing device, focusing method and a pattern inspecting apparatus

The present invention provides a pattern evaluating device including light irradiating means for irradiating the rays of light from a light source upon an object, an objective lens through which the light having penetrated through the object passes, an aperture member stopping the diameter of a light beam which has passed the objective lens, a photo receiving element receiving the light beam which has had the diameter stopped by the aperture member, and judging means for evaluating the pattern, following the information of the light received by the photo receiving element and which corresponds to the pattern, wherein the aperture member is capable of changing the numerical aperture, depending whether or not the sample is provided with a pericle.

Pattern evaluation apparatus and a method of pattern evaluation

A pattern defects inspection system inspects the presence/absence of pattern defects in a photomask as an object to be inspected in which a chromium pattern and a phase shift pattern are formed together. Measurement data output from a sensor circuit for generating measurement pattern data by inspecting measurement patterns corresponding to two types of patterns formed on the object by radiating light on the object, and two identifiable design data stored in a magnetic disk unit in advance, i.e., chromium pattern design data used to form a chromium pattern and phase shift pattern design data used to form a phase shift pattern, are read out by a bit pattern generator for performing development processing. The two types of bit data obtained by the bit pattern generator are synthesized according to the same coordinate definition. The synthesized design data is compared with the measurement data by a comparator. As a result, the presence/absence of pattern defects in the object can be determined.

Pattern defects inspection system

A method of measuring non-linearity of a pattern edge of a pattern formed on a metal plate such as a glass plate and an apparatus for measuring the same are disclosed. With this novel pattern edge measurement system, first is to dispose a pattern to be measured so that a photosensitive picture element column in a light-receiving unit is substantially in parallel with a pattern edge of an image of the pattern to effect a relative movement of the light-receiving unit or the image of the pattern so that light-receiving unit traverses the pattern edge. Next is to memorize a signal indicative of a light received by the photosensitive picture element column every predetermined moving distances of the light-receiving unit or the pattern to determine a pattern edge position per each photosensitive picture element by making use of the received light signal. Then, a non-linearity of the pattern is computed on the basis of each pattern edge position. Thus, the novel pattern edge measuring system makes it possible to quantitatively measure a non-linearity of a pattern edge with high precision.

Method and apparatus for measuring non-linearity of a pattern edge

Disclosed is an automatic focusing apparatus which comprises an objective disposed in opposition to a substrate with patterns formed thereon, a first line sensor disposed at a first focal point of the focal length of the objective, second and third line sensors which are disposed closer to and farther from the objective by a given distance with respect to second and third focal points of the focal length of the objective, first to third differential circuits for differentiating the output signals from the first to third line sensors, a detecting circuit for detecting a displacement of the substrate from a predetermined proper distance between the objective and the substrate on the basis of the output signals from the first to third differential circuits, and a correcting device for correcting the displacement on the basis of the output signal from the detecting circuit. Thus, a single optical system is used for automatically correcting focus and pattern inspection.

Automatic focusing apparatus for a semiconductor pattern inspection

An automatic focusing apparatus includes a lens for leading a laser beam onto a sample surface at a predetermined incident angle, a beam splitter to divide the reflected beam from the sample surface in accordance with the vertical shift thereof, a pair of photo diodes to respectively receive the divided beams and produce electric signals, a differential amplifier to produce a differential signal between the electric signals and a mechanism to vertically shift the stage by means of the differential signal to automatically focus a lens system on said sample surface.

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Kanagawa, Japan

Tomohide Watanabe