Okamoto Machine Tool Works, Ltd.

Tomio Kubo

Kazuo Kobayashi

Moriyuki Kashiwa

Eiichi Yamamoto

Satoru Ide

Etsuo Fujita

Noriyuki Motimaru

Hiroaki Kida

A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

Semiconductor substrate planarization apparatus and planarization method

To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening platealso is a load on the grindstonethat does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

Substrate flat grinding device

Growing community of inventors

Annaka, Japan

Tomio Kubo