Boston University

Optech Ventures, LLC

Northeastern University

Todd W Murray

Marvin E Klein

Charles A DiMarzio

Claire Prada

Ronald A Roy

Luis A Nieva

Oluwaseyi Balogun

Gopi Maguluri

Florian J Blonigen

Lei Sui

A device detects underfill voids and solder ball defects via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using probe and detection beams of different wavelengths. Resolution of less than 100 &#x3bc;m features was demonstrated for silicon flip chips.

Device for laser-ultrasonic detection of flip chip attachment defects

A laser-based ultrasonic technique for the inspection of thin plates and membranes employs an amplitude-modulated laser source to excite narrow bandwidth Lamb waves. The dominant feature in the acoustic spectrum is a sharp resonance peak that occurs at the minimum frequency of the first-order symmetric Lamb mode, where the group velocity of the Lamb wave goes to zero while the phase velocity remains finite. Experimental results with the laser source and receiver on epicenter demonstrate that the zero group velocity resonance generated with a low power modulated excitation source can be detected using an optical probe such as a Michelson interferometer coupled to a lock-in amplifier. This resonance peak is sensitive to the thickness and mechanical properties of plates and may be suitable, for example, for the measurement and mapping of nanoscale thickness variations.

Non-destructive imaging, characterization or measurement of thin items using laser-generated lamb waves

A system and method of detecting acousto-photonic emissions in optically turbid media that provide increased levels of detection sensitivity. The detection system includes an ultrasonic transducer, a laser, a photo-detector for detecting ultrasound-modulated laser light, and circuitry for processing the detected signals for subsequent analysis. The ultrasonic transducer generates an ultrasonic wave that propagates within an optically turbid medium. The laser generates a coherent light beam, which is split to form signal and reference beams. The signal beam is sent through the turbid medium, where it is phase modulated by the ultrasound. The ultrasound-modulated signal beam is provided to a photo-refractive crystal for subsequent interference with the reference beam to convert the phase modulation to intensity modulation. The DC offset of the signal beam intensity provides a measure of the magnitude of the mean phase shift induced by the ultrasound on the multiply scattered optical field within the turbid medium.

Enhanced detection of acousto-photonic emissions in optically turbid media using a photo-refractive crystal-based detection system

Apparatus for analyzing thin surface layers. An acoustic wave generating laser beam is amplitude modulated with continuous wave modulation of a frequency in the megahertz to gigahertz range and an optical system directs the modulated radiation to a surface of a thin surface layer. This in turn causes an acoustic wave that is sensed and analyzed to provide an indication of properties of thin surface layer.

Characterization of micro- and nano scale materials by acoustic wave generation with a CW modulated laser

Underfill voids and solder ball defects are detected via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Alternatively, the generation laser beam may be absorbed in the bulk of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using overlapping probe and detection beams of different wavelengths. Resolution of less than 100 &#x3bc;m features was demonstrated for silicon flip chips.

Growing community of inventors

Medford, MA, United States of America

Todd W Murray