Advantest America, Inc.

Touchdown Technologies, Inc.

Ting Hu

Melvin Khoo

Nim Tea

Florent Cros

Lakshmi Namburi

Zhiyong An

Matthew Losey

An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; wherein each probe is capable of elastic deformation when the probe tip comes in contact with the electronic devices; each probe comprising a plurality of isolated electrical vertical interconnect accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same

An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle between &#x2212;90 degrees and 90 degrees, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe. And, the moment of inertia for the torsion and/or bending elements can by manipulated to achieve the desired probe characteristics. Other features include a various union angle interface edge shapes, pivot cutouts and buffers.

Probe for testing semiconductor devices

A novel probe design is presented that increases a probe tolerance to stress fractures. The probe includes a base, a torsion element connected to the base, and a second element connected to the torsion element through a union angle. The union angle includes an interface between the torsion element and the second element, and the edge of the interface is shaped to diffuse stress. What is further-disclosed are three features that increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.

Probe for testing semiconductor devices with features that increase stress tolerance

A hybrid probe design is presented that includes a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The probe includes a base, a torsion element, a bending element, and a tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Adjusting the position of a pivot can alter the probe's energy absorption characteristics. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.

Growing community of inventors

Monrovia, CA, United States of America

Ting Hu