Richtek Technology Corporation, R.o.c

Tsinghua University

Richtek Technology Corporation

Ting-Fu Chang

Chih-Fang Huang

Tsung-Yi Huang

Chien-Wei Chiu

Tsung-Yu Yang

Tsung-Chieh Hsiao

Ya-Hsien Liu

Po-Chin Peng

Hung-Der Su

Chun-Hung Wu

Jheng-Yi Jiang

Keh-Yung Cheng

Yu-Li Wang

Wei-Chen Yang

Shao-Yen Chiu

K C Chang

Hua-Chih Hsu

Yi-Chen Li

A structure of high electron mobility light emitting transistor comprises a substrate, a HEMT region disposed on the substrate, and a gallium nitride LED (GaN-LED) region disposed on the substrate. A two-dimensional electron gas layer is present in each of the HEMI region and the LED region, and the HEMT region is coupled to the LED region through the two-dimensional electron gas layer.

Structure of high electron mobility light emitting transistor

A semiconductor structure comprises a substrate, an epitaxial layer, an active area and a termination. The substrate has a first conducting type of semiconductor material. The epitaxial layer disposed on the substrate has a first conducting type of semiconductor material. The active area is a working area of the semiconductor structure. The termination protects the active area. The termination has a junction termination extension (JTE) having a second conducting type of semiconductor material. The counter-doped area is disposed in the JTE area and has the first conducting type of semiconductor material. A dose of the first conducting type of semiconductor material in the counter-doped area increases along one direction.

Semiconductor structure

The present invention discloses an insulated gate bipolar transistor (IGBT) and a manufacturing method thereof. The IGBT includes: a gallium nitride (GaN) substrate, a first GaN layer with a first conductive type, a second GaN layer with a first conductive type, a third GaN layer with a second conductive type or an intrinsic conductive type, and a gate formed on the GaN substrate. The first GaN layer is formed on the GaN substrate and has a side wall vertical to the GaN substrate. The second GaN layer is formed on the GaN substrate and is separated from the first GaN layer by the gate. The third GaN layer is formed on the first GaN layer and is separated from the GaN substrate by the first GaN layer. The gate has a side plate adjacent to the side wall in a lateral direction to control a channel.

Insulated gate bipolar transistor with a lateral gate structure and gallium nitride substrate and manufacturing method thereof

Insulated gate bipolar transistor with a lateral gate structure and gallium nitride substrate

The present invention discloses a junction barrier Schottky (JBS) diode and a manufacturing method thereof. The JBS diode includes: an N-type gallium nitride (GaN) substrate; an aluminum gallium nitride (AlGaN) barrier layer, which is formed on the N-type GaN substrate; a P-type gallium nitride (GaN) layer, which is formed on or above the N-type GaN substrate; an anode conductive layer, which is formed at least partially on the AlGaN barrier layer, wherein a Schottky contact is formed between part of the anode conductive layer and the AlGaN barrier layer; and a cathode conductive layer, which is formed on the N-type GaN substrate, wherein an ohmic contact is formed between the cathode conductive layer and the N-type GaN substrate, and the cathode conductive layer is not directly connected to the anode conductive layer.

Junction barrier Schottky diode and manufacturing method thereof

The present invention discloses a high electron mobility transistor (HEMT) and a manufacturing method thereof. The HEMT device includes: a substrate, a first gallium nitride (GaN) layer; a P-type GaN layer, a second GaN layer, a barrier layer, a gate, a source, and a drain. The first GaN layer is formed on the substrate, and has a stepped contour from a cross-section view. The P-type GaN layer is formed on an upper step surface of the stepped contour, and has a vertical sidewall. The second GaN layer is formed on the P-type GaN layer. The barrier layer is formed on the second GaN layer. two dimensional electron gas regions are formed at junctions between the barrier layer and the first and second GaN layers. The gate is formed on an outer side of the vertical sidewall.

High electron mobility transistor and manufacturing method thereof

The present invention discloses a high electron mobility transistor (HEMT) and a manufacturing method thereof. The HEMT includes a semiconductor layer, a barrier layer on the semiconductor layer, a piezoelectric layer on the barrier layer, a gate on the piezoelectric layer, and a source and a drain at two sides of the gate respectively, wherein each bandgap of the semiconductor layer, the barrier layer, and the piezoelectric layer partially but not entirely overlaps the other two bandgaps. The gate is formed for receiving a gate voltage. A two dimensional electron gas (2DEG) is formed in a portion of a junction between the semiconductor layer and the barrier layer but not below at least a portion of the piezoelectric layer, wherein the 2DEG is electrically connected to the source and the drain.

Growing community of inventors

Taipei, Taiwan

Ting-Fu Chang