Fsi International, Inc.

Tel Manufacturing and Engineering of America, Inc.

Tim W Herbst

Thomas J Wagener

Kevin L Siefering

Tracy A Gast

Edward Hanzlik

Todd K Maciej

Michael Gruenhagen

Cleaning systems and methods for semiconductor fabrication use rotatable and translatable chuck assemblies that incorporate a compact drive system to cause chuck rotation. The system uses an offset drive gear that drives a ring gear. This reduces components whose friction or lubricants might generate undue contamination. The low friction chuck functionality of the present invention is useful in any fabrication tool in which a workpiece is supported on a rotating support during a treatment. The chuck is particularly useful in cryogenic cleaning treatments.

Translating and rotating chuck for processing microelectronic substrates in a process chamber

A microelectronic substrate handling device comprising first and second support structures spaced from each other, the first support structure having a series of upper teeth defining a series of upper notches extending along a length of the first support structure and a series of lower teeth defining a series of lower notches extending along a length of the first support structure, each of the upper and lower notches opening toward the second support structure, wherein the upper and lower notches are offset from each other by a predetermined offset distance so that an edge of a microelectronic device will fit differently within the upper and lower notches of the first support structure when supported between the first and second support structures.

Edge gripping device for handling a set of semiconductor wafers in an immersion processing system

Growing community of inventors

Minneapolis, MN, United States of America

Tim W Herbst